Active Member
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Address: 810-818#, Yufeng building,6-9# Jinhai road, Yantian community,Xixiang street,Bao'an district, Shenzhen city
Contact name:
MOKO TECHNOLOGY LTD |
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High frequency 1OZ Protel BGA soldering OSP single layer Fr-4 1.6MM
Board PCB Prototype Fabrication
Fr-4 PTH PCB, Fr4,94v0
Quickly delivery&Hasl lead free
High quality&competitive price
1, copper clad pcb printed circuit board manufacturer
2, FR4 material
3,immersion gold
4,green solder mask
5,white silk
6,Board thinkness 1.6mm
7.pcb certificate:UL/SGS/Rohs/ISO9001/ISO14000
8.OEM service offered
9.competitive price
10.timely delivery
Quotation time:
1. For PCB & FPC: quotation within 1 hours if all information are clear
2. For PCBA: quotation within 2 days if all information are clear
One-stop Service:
1. PCB Copy
2. PCB drawing / design according to your schematic diagram
3. PCB manufacturing
4. Component sourcing
5. PCB Assembly
6. PCBA tes
production Capability:Files | Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
Layer No. | 1 - 12 Layers |
Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
Board Thickness Tolerance | ±10% |
Copper thickness | 0.5OZ - 4OZ |
Impedance Control | ±10% |
Warpage | 0.075%-1.5% |
Peelable | 0.012"(0.3mm)-0.02’(0.5mm) |
Min Trace Width (a) | 0.004"(0.1mm) |
Min Space Width (b) | 0.004"(0.1mm) |
Min Annular Ring | 0.004"(0.1mm) |
SMD Pitch (a) | 0.012"(0.3mm) |
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
Regesiter torlerance | 0.05mm |
Min Solder Mask Dam (a) | 0.005"(0.125mm) |
Soldermask Clearance (b) | 0.005"(0.125mm) |
Min SMT Pad spacing (c) | 0.004"(0.1mm) |
Solder Mask Thickness | 0.0007"(0.018mm) |
Hole size | 0.008"(0.20mm)-- 0.257"(6.5mm) |
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
Aspect Ratio | 10:01 |
Hole Registration | 0.003"(0.075mm) |
HASL | 2.5um |
Lead free HASL | 2.5um |
Immersion Gold | Nickel 3-7um Au:1-3u'' |
OSP | 0.2-0.5um |
Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
Beveling | 30°45° |
V-cut | 15° 30° 45° 60° |
Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
Certificate | ROHS ISO9001 TS16949 SGS UL |
Special requirements | Buried&blind vias, Impedance control, via plug, BGA soldering and gold fing |
