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Custom 3.0mm Board 5OZ Baked Immersion gold prototype BT printed circuit boards Circuit Assemblies

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Address: 810-818#, Yufeng building,6-9# Jinhai road, Yantian community,Xixiang street,Bao'an district, Shenzhen city

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City & Province	shenzhen guangdong

Custom 3.0mm Board 5OZ Baked Immersion gold prototype BT printed circuit boards Circuit Assemblies

Specifications

Product	Single sided to 12 layers PCB
Material	FR1, FR2, CEM1, CEM3, FR4, BT
Board thickness	0.4mm to 3.2mm
Base copper	H oz to 6oz
Min. hole size Min LW/LS	0.3mm 0.1mm(Flash Gold)/0.15mm(HASL)
Aspect ratio	1 : 6
Soldermask	LPI type, Baked type, Peelable mask
Surface finishing	HASL, Flash gold, Immersion gold, Gold finger, Carbon ink
Max. panel size	508mm x 610mm
Bow & twist	0.7% (1.5mm board)
Hole size tol.	PTH: +/-0.08mm, NPTH: +/-0.05mm
Hole location tol.	+/-0.05mm
Gold thickness	0.05um to 1.5um
Nickel thickness	1um to 5um

1.PCB
2.4layers with chem.gold
3.1.2mm thickness board
4.UL ISO9001 certificater
5.Solder mask:blue

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