Active Member
|
Address: 810-818#, Yufeng building,6-9# Jinhai road, Yantian community,Xixiang street,Bao'an district, Shenzhen city
Contact name:
MOKO TECHNOLOGY LTD |
|
|
Electronic Components PCB Assembly
1.Electronic Components Puchase, PCB Assembly Service
2.UL, SGS, Rohs Certificate
3.Competitive Price, High Quality, Fast delivery
4.Certain Testing service for free.Reply within 2hours
5.OEM Service are welcome
your single point of contact for all of your raw materials, parts, and pcb assembly, also offers:
- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Product Design
- Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
1.Detailed Specification of PCB Manufacturing
| 1 | Layer | 1-30 layer |
| 2 | Material | FR-4, CEM-1, CEM-3, Hight TG, FR4 Halogen Free, FR-1, FR-2, Aluminum |
| 3 | Board thickness | 0.2mm-7mm |
| 4 | Max.finished board side | 500mm*500mm |
| 5 | Min.drilled hole size | 0.25mm |
| 6 | Min.line width | 0.075mm(3mil) |
| 7 | Min.line spaceing | 0.075mm(3mil) |
| 8 | Surface finish/treatment | HALS/HALS lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating |
| 9 | Copper thickness | 0.5-4.0oz |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Inner packing | Vacuum packing, Plastic bag |
| 12 | Outer packing | Standard carton packing |
| 13 | Hole tolerance | PTH:±0.076, NTPH:±0.05 |
| 14 | Certificate | UL, ISO9001, ISO14001, ROHS, CQC |
| 15 | Profiling Punching | Routing, V-CUT, Beveling |
| 16 | Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
2.Detailed Terms for Pcb Assembly
Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206, 0805, 0603 components SMT technology
3) ICT(In Circuit Test), FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL, CE, FCC, Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
