Active Member
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[China]
Address: Shenzhen Guangming yulv Village Road Jade Spring beauty industrial district 18-1 building
Contact name:Fu
Shenzhen Jingbang Technology Co. , Ltd |
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ADVANCED INSPECTION MACHINE:
FASTPCBA Co., LIMITED advanced PCB production and testing equipment purchased from the United States, Japan, Germany, Israel and other places to improve production testing and technical capabilities. Adopting international advanced process technology and advanced management methods, the technological level is constantly improved from their high standards and strict requirements.
PCB Capability
| Article | Description | Capability |
| Material | Laminate materials | FR4, High TG FR4, High Frequency, Alum, FPC... |
| Board Cutting | Number of layers | 1-48 |
| Min.thickness for inner layers (Cu thickness are excluded) | 0.003”(0.07mm) | |
| Board Thickness | Standard | (0.1-4mm±10%) |
| Min. | Single/Double:0.008±0.004” | |
| 4layer:0.01±0.008” | ||
| 8layer:0.01±0.008” | ||
| Bow and twist | no more than 7/1000 | |
| Copper Weight | Outer Cu weight | 0.5-4 0z |
| Inner Cu weight | 0.5-3 0z | |
| Drilling | Min size | 0.0078”(0.2mm) |
| Drill deviation | ±0.002″(0.05mm) | |
| PTH hole tolerance | ±0.002″(0.005mm) | |
| NPTH hole tolerance | ±0.002″(0.005mm) | |
| Solder Mask | Color | Green,white,black,red,blue… |
| Min solder mask clearanace | 0.003″(0.07mm) | |
| Thickness | (0.012*0.017mm) | |
| Silkscreen | Color | white,black,yellow,blue… |
| Min size | 0.006″(0.15mm) | |
| Max Size of Finish Board | 700*460mm | |
| Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | |
| PCB Outline | Square,circle,irregular(with jigs) | |
| Package | QFN,BGA,SSOP,PLCC,LGA | |
PRODUCT CONFIGURATION:
4/2 (optional 6-inch) image intensifier and megapixel digital
camera;
90KV / 100KV-5 micron X-ray source
Simple mouse click operation to write detection program;
High detection repeat accuracy;
Rotational tilt of plus or minus 60 degrees allows unique
perspectives to detect samples;
High-performance stage control;
Large navigation window-easy to locate and identify defective
products;
Automatic BGA detection program accurately detects every BGA bubble
Make judgments according to customer needs and output Excel
reports.
PRODUCT APPLICATION:
PCBA solder joint inspection (BGA, CSP, POP and other components
inspection)
Battery (Pole piece solder joint defect detection, cell winding
condition detection)
Electronic connectors (harnesses, cables, plugs, etc.)
Automotive electronics (testing of patch cords, dashboards, etc.)
Solar, photovoltaic (wafer solder joint inspection)
Testing for special industries such as aviation components
Semiconductor (package component inspection)
LED detection
Electronic module detection
Ceramic products testing
