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Magnetron Sputtering Deposition in Decorative Coating Field
Applications
| Applications | Specific Purpose | Material Type |
| Decorative coating | Colored film, Metallized film | Al2O3, TiO2, and all kinds of metal films |
Working Principle
Magnetron sputtering is to increase sputtering rate by introducing
a magnetic field on the target surface and using
the magnetic field to constrain the charged particles to increase
the plasma density.
Features
| Model | MSC-DC-X—X |
| Coating type | Various dielectric films such as metal film, metal oxide and AIN |
| Coating temperature range | Normal temperature to 500℃ |
| Coating vacuum chamber size | 700mm*750mm*700mm (Customizable) |
| Background vacuum | < 5×10-7mbar |
| Coating thickness | ≥ 10nm |
| Thickness control precision | ≤ ±3% |
| Maximum coating size | ≥ 100mm (Customizable) |
| Film thickness uniformity | ≤ ±0.5% |
| Substrate carrier | With planetary rotation mechanism |
| Target material | 4×4 inches(compatible with 4 inches and below) |
| Power supply | The power supplies such as DC, pulse, RF, IF and bias are optional |
| Process gas | Ar, N2, O2 |
| Note: Customized production available. | |
Coating Sample
Process Steps
→Place the substrate for coating into the vacuum chamber;
→ Roughly vacuumize;
→ Turn on molecular pump, vacuumize at top speed, then turn on the
revolution and rotation;
→ Heating the vacuum chamber until the temperature reaches the
target;
→ Implement the constant temperature control;
→ Clean elements;
→ Revolve and back to the origin;
→ Coating film according to process requirements;
→ Lower temperature and stop the pump assembly after coating ;
→ Stop working when the automatic operation is finished.
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