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High density Multilayer Electonic FR4 PCB Board

Shen Zhen Xu Xin Technology Co., Ltd.
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Address: 7/F, High-Tech Park, Shangkeng Community, Guanlan Subdist., Baoan District, Shenzhen, Guangdong, China (Mainland)

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Shen Zhen Xu Xin Technology Co., Ltd.

High density Multilayer Electonic FR4 PCB Board

City & Province shenzhen guangdong
Categories Solar Chargers
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Product Details

High density Multilayer Electonic FR4 PCB Board

Specifications

 
1. Multilayer FR4 PCB board,green soldermask&silksceen
2.HAL,E-Test
3.Thermal consideration,B/B design
4.Fast lead time


 

 

 your single point of contact for all of your raw materials, parts, and PCB assembly, also offers:

- Contract Manufacturing 

- Engineering Services 

- PCB Design & Assembly 

- Product Design 

- Prototyping 

- Cable and Wire Assemblies 

- Plastics and Molds

1.Detailed Specification of PCB Manufacturing

1

layer

1-18 layer

  2

Material

FR-4,CEM-1,CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2

3

Board thickness

0.2mm-4mm

4

Max.finished board side

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish/treatment

HALS/HALS lead free,Chemical tin,Chemical Gold,

Immersion gold Immersion Silver/Gold,Osp,Gold Plating

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,CQC

15

profiling punching

Routing,V-CUT,Beveling

16. providing OEM service to all sorts of printed circuit board assembly

 

 

2.Detailed Terms for Pcb Assembly

 

 

Technical requirement:

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

Quote requirement:

· Gerber file of the bare PCB board

· BOM (Bill of material) for assembly

· To short the lead time, please kindly advise us if there is any acceptable components substitution.

· Testing Guide & Test Fixtures if necessary

· Programming files & Programming tool if necessary

· Schematic if necessary

OEM/ODM/EMS Services for PCBA:

· PCBA, PCB assembly: SMT & PTH & BGA

· PCBA and enclosure design

· Components sourcing and purchasing

· Quick prototyping

· Plastic injection molding

· Metal sheet stamping

· Final assembly

· Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)

· Custom clearance for material importing and product exporting

Orientronic PCB assembly Equipment:

· SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4

· Reflow Oven: FolunGwin FL-RX860

· Wave Soldering Machine: FolunGwin ADS300

· Automated Optical Inspection (AOI): Aleader ALD-H-350B

· Fully Automatic SMT Stencil Printer: FolunGwin Win-5

 

 

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