Active Member
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[China]
Address: Room 906, Tower B, Wanda Plaza Office Building, No. 171 Zhongyuan Rd, Zhongyuan District, Zhengzhou , Henan, China
Contact name:Sarah
Henan More Superhard Products Co., Ltd |
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1V1 resin bond diamond grinding wheel for Semiconductor materials
Characteristics:
1. for grooving and cutting with less procedure
2. Ultra-thin, Highprecision,Super hardness
3. Minimum thickness: 0.18mm
4. Max speed: 30K rounds/min.
5. Cutting speed: 5~10mm/sec.
6. Grit size(granularity): 80#~2000#
7. Cutting precision: ±0.005mm
8. Electroconductive
9. Working condition: dry or wet cutting
10. Additional function: slots for removing chips
11. Single wheel or bundle, both are available
12. Body core(steel/alumina) is enhancive
Available Material:
1. Diamond
2. Metal-bond diamond (hold the grits strongly, good wear resistance&shape maintenance)
3. Resin-bond diamond (the elastic resin bond makes the surface improved, super sharp)
4. CBN (mainly used for high-hardness materials grooving and cutting, like tool steel, mould steel, heat-resistant steel, stainless steel, casting iron etc.)
Can be used for cutting:
1. Semiconductor materials
2. Oxide ceramic materials
3. Magnetic materials
4. Crystal, glass, quartz, carbide...etc.
Features: |
1. Resin diamond wheel for PCD cutting tools, carbide cutting tools |
7. Increased feed rates |
8. Good shaped |
9. No dressing tools and less heat occurs to avoid burning the workpiece are just some of the advantages of our grinding wheels can provide for you. And the dynamic balance can achieve at G0.4 for our vitrified wheels. |
