|
[China]
Trade Verify
Address: No.188 Gaoxin Road,Weibin District Baoji City,Shaanxi,China
Contact name:Nicole
Shaanxi Peakrise Metal Co.,Ltd |
|
Verified Suppliers
|
|
|
Copper -Molybdenum -Copper Alloy Material, CMCC Cu/MoCu/Cu
1.CMCC Cu/MoCu/Cu Alloy Copper -Molybdenum Copper -Copper Alloy description:
Similar to copper/molybdenum/copper (CMC), copper/molybdenum-copper/copper is also a sandwich structure, which consists of two sublayers - copper (Cu) wrapping a core layer - molybdenum copper alloy (MoCu), which is in the X region Compared with tungsten-copper, molybdenum-copper and copper/molybdenum/copper materials, copper-molybdenum-copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively advantageous price.
2. Parameter of CMCC Cu/MoCu/Cu Alloy Copper- Molybdenum Copper-Copper Alloy:
Grade | Content (Cu:Mo70Cu:Cu) | Density (g/cm3) | Thermal conductivity (W/M.K) | Thermal expansion coefficient (10-6/k) | Tensile strength (Mpa) |
Cu-MoCu-Cu141 | 1:4:1 | 9.5 | 7.3-10.0-8.5 | ||
Cu-MoCu-Cu232 | 2:3:2 | 9.3 | 7.3-11.0-9.0 | ||
Cu-MoCu-Cu111 | 1:1:1 | 9.2 |
| ||
Cu-MoCu-Cu212 | 2:1:2 | 9.1 |
|
3. Feature of CMCC Cu/MoCu/Cu Alloy Copper- Molybdenum Copper -Copper Alloy:
1). The performance and use of this product are similar to that of
copper, molybdenum and copper. The core material is usually
Mo70Cu30, and Mo50Cu50 can also be used. The thermal expansion
coefficient of copper molybdenum copper copper is adjustable.
Copper-Molybdenum Copper-Copper has different coefficients of
thermal expansion in the X and Y directions and has a higher
thermal conductivity than tungsten-copper, molybdenum-copper and
CMC. Cu-MoCu-Cu can also be stamped.
2). During operation, power electronics and circuits produce a lot
of heat. The heat sink material helps to dissipate heat from the
chip, transfer it to other media, and maintain stable operation of
the chip.
3). It has a thermal expansion coefficient and high thermal
conductivity matching with different substrates; excellent high
temperature stability and uniformity; excellent processing
performance;
4). Higher thermal conductivity than CMC.
5). Can be punched into parts to reduce costs.
6). The interface is firmly bonded and can withstand repeated high
temperature shocks at 850°C
7). The thermal expansion coefficient can be designed to match with
materials such as semiconductors and ceramics.
8). Non-magnetic.
4. Applictaion of CMCC Cu/MoCu/Cu Alloy Copper- Molybdenum Copper -Copper Alloy:
The coefficient of expansion and thermal conductivity of copper-molybdenum-copper-copper can be designed for RF, microwave and semiconductor high-power devices.
