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Address: No.188 Gaoxin Road,Weibin District Baoji City,Shaanxi,China
Contact name:Nicole
Shaanxi Peakrise Metal Co.,Ltd |
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Mo + 0.40-0.55%Ti + 0.06-0.12%Zr TZM Molybdenum Alloy Disc
1. Description of Mo+0.4~0.55%Ti+0.06~0.12%Zr TZM Molybdenum Alloy Disc:
TZM molybdenum alloy disc is currently the most excellent molybdenum alloy high temperature material. It is a solid solution hardening and particle reinforced molybdenum-based alloy, TZM is harder than pure molybdenum metal, and has a higher recrystallization temperature and better creep resistance, the recrystallization temperature is about 1400 ℃, much higher For molybdenum, it can provide better solderability.
2. Size of Mo+0.4~0.55%Ti+0.06~0.12%Zr TZM Molybdenum Alloy Disc:
Disc diameter : 20－600mm
Disc thickness: 6－25mm
Surface: black,C.C,bright,polished
Standard: ASTMB 386
Also we can process as per customer's request.
3. Mechanical properties of Mo+0.4~0.55%Ti+0.06~0.12%Zr TZM Molybdenum Alloy Disc:
Elongation /% | Elastic Modulus /GPa | Yield Strength /MPa | Tensile Strength /MPa | Fracture Toughness /(MP·m1/2) |
<20 | 320 | 560~1150 | 685 | 5.8~29.6 |
4. Actual measured chemical composition of TZM Molybdenum Alloy Disc:
| Element | Si | Mn | Ni | Cu | V | Zr | O | P | Fe | Mg |
| Concentration(%) | 0.002 | 0.0009 | 0.0008 | 0.0018 | 0.013 | 0.086 | 0.32 | 0.001 | 0.0011 | 0.0015 |
| Element | Al | Ti | Ca | C | N | |||||
| Concentration(%) | 0.001 | 0.5 | <0.001 | 0.012 | 0.0022 | |||||
| Purity(Metallic Base) Mo≥99.06%(TZM) | ||||||||||
5. Application of Mo+0.4~0.55%Ti+0.06~0.12%Zr TZM Molybdenum Alloy Disc:
TZM Molybdenum Alloy Disc mainly used for high-temperature furnace components, crucibles, missiles and other rocket nozzle under high temperature.
TZM Molybdenum Alloy Disc are widely used as contact materials in
silicon controlled rectifiers diodes, transistors and thyristors
(GTO’S). Other than in specialist applications, molybdenum is now
accepted as the first choice mounting material for power
semiconductor devices due to its significantly lower cost and
weight.The fact that both materials have a similar coefficient of
expansion to silicon combined with high thermal conductivity makes
them an ideal choice, especially in large area power devices where
considerable heat is generated. Further applications include the
use of molybdenum as heat sink bases in IC’S, LSI’S and hybrid
circuits.
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