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Tungsten copper alloy electronic packaging sheet is a material used
in electronic packaging and thermal management. It is usually
composed of two metals, tungsten and copper, and is made by powder
metallurgy or other processing methods.
Tungsten copper alloy is characterized by good thermal conductivity
and high thermal expansion coefficient. Tungsten has a very high
melting point and excellent thermal conductivity, while copper has
high conductivity and low resistivity. Therefore, tungsten copper
alloy can provide good thermal conductivity while maintaining low
electrical resistance and electrical conductivity.
In electronic packaging, tungsten-copper alloy electronic packaging
sheets are usually used to manufacture substrates, heat sinks,
packaging bases and other components of high-power electronic
devices. Its excellent thermal conductivity can help effectively
conduct and disperse the generated heat, thereby improving the
working efficiency and reliability of electronic devices.
In electronic packaging, tungsten-copper alloy electronic packaging
sheets are usually used to manufacture substrates, heat sinks,
packaging bases and other components of high-power electronic
devices. Its excellent thermal conductivity can help effectively
conduct and disperse the generated heat, thereby improving the
working efficiency and reliability of electronic devices.
In addition, tungsten copper alloy can also be adjusted according
to specific application requirements. By adjusting the ratio of
tungsten and copper, the thermal expansion coefficient of the alloy
can be controlled to better match other materials and reduce
thermal stress and thermal cracks.
In summary, tungsten-copper alloy electronic packaging sheet is a
material widely used in high-power electronic devices, which has
good thermal conductivity and adjustable thermal expansion
coefficient, which helps to improve the performance and reliability
of electronic devices.
| Name | Tungsten Copper Alloy Electronic Packaging Sheet |
|---|---|
| Surface | Polished |
| Flexural Strength | ≥1160~≥790MPa |
| Tensile Strength | ≥1000MPa |
| Thermal Conductivity | 80-300W/mK |
| Coefficient of Thermal Expansion | 6.3-9.7×10-6/K |
| Young's Modulus | 155-170GPa |
| Bending Strength | ≥1000MPa |
| Density | 11.9-17.3g/cm3 |
| Impact Strength | ≥30J |
| Focus Keywords | Cu10W90 tungsten copper metal alloy electrode, copper tungsten Electronic package, WCu20 alloy rod bar |
Tungsten Copper Alloy offers technical support and services to ensure product quality, safety, and longevity. Our team of experienced engineers is available to answer questions and provide guidance on product selection, installation, maintenance, and repairs. We provide in-depth technical assistance, including troubleshooting and product testing. Our team can also provide custom design and fabrication services to meet specific application needs. We strive to provide the highest level of customer service and satisfaction.
Tungsten Copper Alloy products are usually packaged and shipped in
boxes, barrels, bags or other appropriate containers. Delivery
times vary depending on the specific product and the customer's
specific requirements. In general, the packaging and shipping
process includes:
1. Inspection of the product to ensure quality and conformity to specifications
2. Wrapping and packaging of the product to protect it during shipment
3. Labeling of the packaging with shipping information
4. Shipment of the product to the customer's location via ground, air, or sea freight
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