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USB Double Sided PCB Mobile Power Bank Battery Charger , Double Sided Aluminium Pcb

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Address: 2F Electronic Industrial Park,ChangChun East Road,ZiYang Dist, YiYang City, HuNan Province,China

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FineCircuit Co., Ltd

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USB Double Sided PCB Mobile Power Bank Battery Charger , Double Sided Aluminium Pcb

Country/Region china
City & Province yiyang hunan
Categories Metal Processing Service

Product Details

USB Mobile Power Bank Board Battery Charger PCB For Phone Printed Circuit Board double sided aluminium pcb

 

PCB TypeMaterial TypeMaterial Brand
Single side pcb
Double side pcb
Multilayer pcb
Single side pcb
CEM-1
FR-4
Aluminum
Copper
Ceramic
SY
KB
IL
LianMao
HongRen
Arlon
KingWong
VT
Laird
5052 Series
 
The advantage of us
1We have our own, independent of the wastewater treatment system.Make sure there will be a very big development space and the stability of the production environment in the futurer
2Flexible operation, can be in the production of small batches.Also can produce large quantities.Can save production quickly.
3The urgent double sample production for 24 hours, The urgent Multilayer sample production for 48 hours.completely according to customer requirements
About the Files
1You have gerber files or PCB files
2You have PCB samples. send to us the sample. we will help for free copy it
 
How to calculate the price
1For example, your double sided PCB size is 100 mm * 200 mm wide, long double sided PCB price is $60 a square meters.So the calculation results 100MM*200MM*$60/1000000=$1.2
1 inch=25.4mm
 
About the transportation.
All the quotation does not include the transportation cost
 
1You find a freight forwarding company to help you, When we finished the PCB ,We wiill send to your forwarder company directly .You directly to the transport charges paid to forwarder company
2We help you responsible for transport, freight included in the price.According to how much money a kilogram computation.
3In order to save costs.The best is you have familiar forwarder company

 

The Double side apply to Communication, digital, MP3, DVD, computer motherboard, notebook motherboard, network equipment board, instrument panel, switches, routers, set-top boxes, digital camera, printer, radio, etc. All products are high precision.Company introduced abroad a large number of advanced manufacturing equipment and testing equipment, to meet customer demand for product quality;Product quality in line with international IPC, UL standard, but also achieve the requirements of the eu ROHS directive, passed the ISO - 9001:2000 quality system certification.

 

 

Process Capability 
 
Material Type: FR4/Aluminum/Ceramic/CEM-1/Copper/polytefCooper thickness: 0.5-12OZ
Board Thickness: 0.2-6.0mmMin hole size: 0.25mm( finished hole size)
Min Line Width/spacing:0.08mmDrilling accuracy:+/-0.05
Max working size:520*620mm(21.25x24.5inch)Min Inner layer thickness:0.1mm
Min thickness Board for HAL surface finished:0.4mmCertificate: Rohs, Iso9001, UL(in certification)
Min thickness 4 layer: 0.4mmMin thickness 6 layer:0.6mm
Min/Max layer count : 1/20Lamination evenness :+/-0.05mm
Min SMD Pitch : 0.125mmMin Dam Between Fine Pitch: >0.1mm
Layer to Layer registration:<0.1mmImpedance control:+/-5%
Differential impedance:+/-10%Board bow/twist tolerance:<0.7%
Plating spect ratio: <8:1Plating COV: <10%
Surface Finished: LF-HASL ,Immersion Gold/Tin/Silver ./Plating Gold/OSP,PTH backlight : 9-9.5 level
Solder Mask:Green , Red, Blue,White, Black,Yellow.Plating extensibility:>15%
Process Capability 
 
Material Type: FR4/Aluminum/Ceramic/CEM-1/Copper/polytefCooper thickness: 0.5-12OZ
Board Thickness: 0.2-6.0mmMin hole size: 0.25mm( finished hole size)
Min Line Width/spacing:0.08mmDrilling accuracy:+/-0.05
Max working size:520*620mm(21.25x24.5inch)Min Inner layer thickness:0.1mm
Min thickness Board for HAL surface finished:0.4mmCertificate: Rohs, Iso9001, UL(in certification)
Min thickness 4 layer: 0.4mmMin thickness 6 layer:0.6mm
Min/Max layer count : 1/20Lamination evenness :+/-0.05mm
Min SMD Pitch : 0.125mmMin Dam Between Fine Pitch: >0.1mm
Layer to Layer registration:<0.1mmImpedance control:+/-5%
Differential impedance:+/-10%Board bow/twist tolerance:<0.7%
Plating spect ratio: <8:1Plating COV: <10%
Surface Finished: LF-HASL ,Immersion Gold/Tin/Silver ./Plating Gold/OSP,PTH backlight : 9-9.5 level
Solder Mask:Green , Red, Blue,White, Black,Yellow.Plating extensibility:>15%
Process Capability 
 
Material Type: FR4/Aluminum/Ceramic/CEM-1/Copper/polytefCooper thickness: 0.5-12OZ
Board Thickness: 0.2-6.0mmMin hole size: 0.25mm( finished hole size)
Min Line Width/spacing:0.08mmDrilling accuracy:+/-0.05
Max working size:520*620mm(21.25x24.5inch)Min Inner layer thickness:0.1mm
Min thickness Board for HAL surface finished:0.4mmCertificate: Rohs, Iso9001, UL(in certification)
Min thickness 4 layer: 0.4mmMin thickness 6 layer:0.6mm
Min/Max layer count : 1/20Lamination evenness :+/-0.05mm
Min SMD Pitch : 0.125mmMin Dam Between Fine Pitch: >0.1mm
Layer to Layer registration:<0.1mmImpedance control:+/-5%
Differential impedance:+/-10%Board bow/twist tolerance:<0.7%
Plating spect ratio: <8:1Plating COV: <10%
Surface Finished: LF-HASL ,Immersion Gold/Tin/Silver ./Plating Gold/OSP,PTH backlight : 9-9.5 level
Solder Mask:Green , Red, Blue,White, Black,Yellow.Plating extensibility:>15%

 

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