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[China]
Trade Verify
Address: NO.1,Minxing1 Road,Shangjiao Community Chang`an Town,Dognguan City,Guangdong Province.CHN.
Contact name:Xiao
Dongguan MENTO Intelligent Technology Co., Ltd. |
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Verified Suppliers
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S2020 Semiconductor wire bonding inspection
| Device model | S2020 | ||
| Detection capacity | Detection items | Wire bonding inspection | |
| Detection type | Ball size, solder offset, solder bridging, miss planting ball, particle, solder overlap, solder break, , welding wrong wire, wire break, wire collapse, wire bridging, wire residue, welding wire interleaving | ||
| Optical system | Camera | 20MP | |
| Telecentric lens | telecentric optical lens | ||
| Resolution | 4um(2.4um~4um optional) | ||
| illuminant | RGB(can be customized) | ||
| Efficiency | 3FOV/s | ||
| Software system | Operating system | Ubuntu | |
| Computer configuration | Host | CPU: Inteli7, RAM: DDR4-128G, GPU: GTX1660-6GB SSD:250G, HDD: 2T | |
| Monitor | 22"LED | ||
| Operating system | Ubuntu | ||
| Detection performance | PCB Thickness | 1~5mm | |
| Component Height | 20mm upper, 30mm lower (special height can be customized) | ||
| Driving equipment | Linear motor + grating ruler | ||
| Moving speed | Max:600mm/s | ||
| PCB transport rail | 900+20mm (from the ground to the fixture surface) | ||
| Parameters | PCB size | Max:350mmx300mm | Max:370mmx350mm |
| Power | AC220V/50Hz/2000W | ||
| Overall size | W1120xD980xH1600 mm | ||
| Weight | ≈800KG | ||
| Air pressure requirements | ≥0.5Mpa | ||
| Environmental requirements | Temperature: 5~40℃, relative humidity 25%~80% (no frost) | ||
| Upstream and downstream equipment communication | Standard SMEMA interface/data communication with die bonding machine | ||
Scientific platform design
Grinding grade motion track design
High repeatability and positioning accuracy, low noise
High-precision motion control system design
Avoid motion system data loss, ensure high-speed and stable operation, and effectively improve motion acceleration and deceleration.
Overall casting structure
Effectively ensure the stability of the continuous operation of the equipment.
Inspection Items
Gold Wire Inspection:Ball size, solder offset, solder bridging, miss planting ball, particle, solder overlap, solder break, , welding wrong wire, wire break, wire collapse, wire bridging, wire residue, welding wire interleaving.
Core inspection: offset, rotation, particle, scratches, reverse and so on.
