LPC1768FBD100 MCU Chips IC MCU 32BIT 512KB FLASH 100LQFP NXP 32 BIT Micro Controllers

LPC1768FBD100 MCU Chips IC MCU 32BIT 512KB FLASH 100LQFP NXP

Product Descriptions:

The LPC1769/68/67/66/65/64/63 are ARM Cortex-M3 based microcontrollers for
embedded applications featuring a high level of integration and low power consumption.
The Arm Cortex-M3 is a next generation core that offers system enhancements such as
enhanced debug features and a higher level of support block integration.
The LPC1768/67/66/65/64/63 operate at CPU frequencies of up to 100 MHz. The
LPC1769 operates at CPU frequencies of up to 120 MHz. The Arm Cortex-M3 CPU
incorporates a 3-stage pipeline and uses a Harvard architecture with separate local
instruction and data buses as well as a third bus for peripherals. The Arm Cortex-M3 CPU
also includes an internal prefetch unit that supports speculative branching.
The peripheral complement of the LPC1769/68/67/66/65/64/63 includes up to 512 kB of
flash memory, up to 64 kB of data memory, Ethernet MAC, USB Device/Host/OTG
interface, 8-channel general purpose DMA controller, 4 UARTs, 2 CAN channels, 2 SSP
controllers, SPI interface, 3 I 2 C-bus interfaces, 2-input plus 2-output I 2 S-bus interface,
8-channel 12-bit ADC, 10-bit DAC, motor control PWM, Quadrature Encoder interface,
four general purpose timers, 6-output general purpose PWM, ultra-low power Real-Time
Clock (RTC) with separate battery supply, and up to 70 general purpose I/O pins.
The LPC1769/68/67/66/65/64/63 are pin-compatible to the 100-pin LPC236x Arm7-based
microcontroller series.

Features:

 Arm Cortex-M3 processor, running at frequencies of up to 100 MHz
(LPC1768/67/66/65/64/63) or of up to 120 MHz (LPC1769). A Memory Protection Unit
(MPU) supporting eight regions is included.
 Arm Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).
 Up to 512 kB on-chip flash programming memory. Enhanced flash memory accelerator
enables high-speed 120 MHz operation with zero wait states.
 In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
bootloader software.
 On-chip SRAM includes:
 32/16 kB of SRAM on the CPU with local code/data bus for high-performance CPU
access.

 Two/one 16 kB SRAM blocks with separate access paths for higher throughput.
These SRAM blocks may be used for Ethernet, USB, and DMA memory, as well as
for general purpose CPU instruction and data storage.
 Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer
matrix that can be used with SSP, I 2 S-bus, UART, Analog-to-Digital and
Digital-to-Analog converter peripherals, timer match signals, and for
memory-to-memory transfers.
 Multilayer AHB matrix interconnect provides a separate bus for each AHB master.
AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC, and
the USB interface. This interconnect provides communication with no arbitration
delays.
 Split APB bus allows high throughput with few stalls between the CPU and DMA.

Parametrics:

 eMetering  Alarm systems
 Lighting  White goods
 Industrial networking  Motor control

LPC1769 LPC1768

LPC1767 LPC1766

LPC1765 LPC1764 LPC1763