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Slip Resistant Ceramic Horizontal Semiconductor Wafer Boat Semiconductor Processing Components

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Dongguan Ming Rui Ceramic Technology Co.,ltd

Slip Resistant Ceramic Horizontal Semiconductor Wafer Boat Semiconductor Processing Components

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Categories Steel Sheets
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Product Details

 

Slip Resistant Ceramic Horizontal Semiconductor Wafer Boat Semiconductor Processing Components

 

Key words : Horizontal Semiconductor Wafer Boat

 

The invention relates to a vertical rack for semiconductor wafer processing having strictly horizontally disposed arms wherein each arm has a rounded tip and a smooth (Ra < 1 < mu >m) upper surface.

 

The manufacture of semiconductor devices such as integrated circuits typically requires heat treating silicon wafers in the presence of reactive gases. During this process, the temperatures and gas concentrations to which the devices are exposed must be carefully controlled, as the devices often include circuitry elements less than 1 um in size which are sensitive to minute variations in the processing environment.

 
The semiconductor manufacturing industry typically processes these wafers in either horizontal or vertical carriers. The horizontal carrier, typically called a "boat", has three or four horizontally disposed bars arranged in a semicircle design, with each bar having inwardly facing grooves set therein at regular intervals. Each set of grooves define a vertical space for carrying a vertically disposed wafer. The vertical carrier, typically called a "vertical rack", has three or four vertically disposed rods (or posts) arranged in a semicircle design, with each post having slots set therein at regular intervals to define a space for supporting a horizontally disposed wafer. To insure the geometrical precision required in this field, the three or four rods are fixed to a top plate and a bottom plate. The portions of the post between each slot, termed "teeth", are identically spaced in order to support wafers at regular intervals from and parallel to the bottom plate. The entire rack is then placed within a vertical furnace for processing the wafers.

 

Horizontal Semiconductor Wafer Boat

 

Because a wafer processed on a vertical rack experiences less of a temperature gradient over its face (as compared to a wafer processed in a horizontal boat), semiconductor manufacturers are increasingly turning to vertical furnaces. There is, however, a drawback to vertical furnacing. The wafers disposed on a conventional vertical rack are supported at their outside edge only. As such, the areas of the wafer resting on these teeth experience higher stress than the rest of the wafer. When temperatures in the furnace exceed about 1000°C, these stresses often become significant and portions of the single crystal wafer move relative to each other along crystallographic plates in response to that stress. This phenomenon, called "slip", effectively destroys the value of the semiconductor devices located in the area of the wafer where slip has occurred.

 

 

Horizontal Semiconductor Wafer Boat Features:

  • High purity
  • Excellent electrical & thermal insulator
  • Exceptional temperature resistance up to 3000°F (1650°C)
  • Outstanding corrosion resistance to acids, solvents, salts, and organics
 Unit95% Al2O399% Al2O3ZrO2GP-Si3N4
Color-whiteivorywhitegray
Densityg/cm³3.703.906.043.31
Water Absorption%0000
Young's ModulusGpa280350205295
Vickers HardnessGpa14201218-20
Flexural Strength ( at R.T. )Mpa280300900650
Compressive Strength ( at R.T. )Mpa2000250022002200
Thermal Conductivity ( at R.T. )W/(m.K)18-25302.225
Thermal Shock ResistanceΔT(°C)220180-200280-350450-650
Max. Working Temperature ( at R.T. )°C150017008001200
Volume Resistivity ( at R.T. )Ω.cm>10^15>10^14>10^12>10^14
Dielectric Constant (1 MHz at R.T. )-9.509.80268.20
Dielectric StrengthkV/mm1622-16

 

Typical Characteristics Rotor: Outside diameter: < 30,00 mm ( 1.18") Thickness: < 7,00 mm ( . 28") Groove(s) dimensions: Width > 0,051 mm ( .0002") Depth > 0,13 mm ( .0052") Length > 2,00 mm ( .0780") Stator: Outside diameter: < 30,00 mm ( 1.18") Thickness: < 7,00 mm ( . 28") Hole diameter: > 0,22 mm x 0,25 mm (.008" x .010") Surface finish, Rotor or Stator Zirconia:  0,025 m (1 in) or N1 Alumina 99,9 %:  0,05 m (2 in) or N2 Alumina 96% or 99,7%:  0,1 to 0,2 m (4 to 8 in) or N3 to N4

 

 

Advantage of Horizontal Semiconductor Wafer Boat

 

1. Isostatic pressed.
2. Fire resistance.

3. Superior mechnical strength.
4. High corrosion and wear resistance.
5. High Temperature Resistance.
6. Good Insulation Performance Precision.
7. Zirconia and alumina ceramic material.

 

They are high corrosion and wear resistance and strong impact resistance and delivers 10 times longer working life than metal plunger. They give a longer life to the sealed packing material.

 

 


 

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Packaging and Shipping

 

Packed in PP bag or sponge tray, then put in standard export carton packing, or OEM packing.

Shipped by Air ( DHL, TNT, UPS, Fedex, EMS ), or Sea transportation.

 

 

 

Company information

 

Who Are We?
 

Mingrui is a professional factory with years OEM experience in manufacturing industrial ceramic parts.
 

What Do We Do?
 

We produce (OEM ) strengthened structure zirconia and alumina ceramic rod,tube, shaft, plate, sleeve, valve, plunger, bearing, nozzle and ceramic arm, they are applicable to instruments, medical instruments, clocks and electronic products, mills, energy and power, machine and metals, autocar and military, spaceflight and some other high-end fields.
 

All of our products with certificates, such as , CE, TUV, and so on.

 

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