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3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light

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Phoenix (suzhou) electronic Co.,ltd

3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light

Country/Region china
City & Province suzhou jiangsu
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Product Details

3V 60MA 0.2W 2016 20-30LM PPT SMD LED CHIP USED FOR LED STRIP

 
Exterior decoration: daytime running light, fog light, turn signal light, rear combination light, license plate lighting, body lighting (such as grille and logo)
Interior: map and interior dome lighting
visualization:
Portable lamp
Display backlight
lighting:
Indoor, outdoor and architectural lighting
Decorative and entertainment lighting
Advertising lighting
Signal lamp
 
1.Feature:

Viewing angle:120 deg

Ø The materials of the LED dice is InGaN

Ø 2.2mm*1.6mm*0.6mm

Ø RoHS compliant lead-free soldering compatible

 

2.Package Structure:

                                                                             Unit: mm Tolerance: +/-0.2mm

 

 

Figure: 0.2W medium power thin series circuit diagram

Tolerance: ±0.2mm unless otherwise noted

Electrodes: Ag Plating Copper Alloy

Encapsulating Resin: Silicon Resin

Package: Heat-Resistant Polymer

 

 3.Electro-Optical Characteristics:                                                       (Each LED @ 60mA, Ta 25℃ )

Product No.MaterialVF(V)ColorRAFlux(lm)
minmaxCIE coordinates x, yminmax
QT-2016ZW-1CSAZInGaN2.83.5Typ x=0.33, y=0.33808528

 

4.Product Specification:

 

ItemSpecificationMaterialQuantity
ChipInGaNInGaN1 in 1
ReflectorWhitePPA 
FrameC2680Silver-Plated Copper 
Gold wire0.9milAlloy 
PhosphorYellowYAG 
EncapsulantMilkyWhiteResin 
Carrier tapeAccording to EIA 481-1A specsConductive black tape4000pcs per reel
ReelAccording to EIA 481-1A specsConductive black4000pcs per reel
LabelRepsn standardPaper 
Packing bag220x240mmAluminum laminated bag/ no-zipperOne reel one bag
CartonRepsn standardPaperNon-specified

 

5.Absolute Maximum Ratings:

 

ItemSymbolAbsolute Maximum RatingsUnit
Forward CurrentIF60mA
Reverse VoltageVr5V
Pulsed Forward CurrentIFP*90mA
Power dissipationPD0.2W
Operating TemperatureTOP-40~85
Storage TemperatureTST-40~85
Electrostatic DischargeESD2000(HBM)V
Junction TemperatureTj110
LED Thermal resistanceRth s-j27℃/W

 

6.Typical Electro-Optical characteristics curves:

 

7.LED Reliability Test List:

 

Test ItemTest ConditionsStandardQty(Pcs)
Life Test25℃,1000Hrs@60mA/22
High Temperature85℃,1000Hrs@60mA/22
Low Temperature-40℃,1000Hrs@60mA/22
High Humidity Heat

85℃,85%RH,

1000Hrs@60mA

/22
Low Temperature Storage-40℃,1000Hrs

JEITA ED-4701

200 202

22
High Temperature Storage100℃,1000Hrs

JEITA ED-4701

200 201

22
Temperature Cycle(-40'C 30mins --25'C(5mins)--100'C(30mins) ,Temp changing rate:3+/-0.6'C/min)

JEITA ED-4701

100 105

22
Thermal Shock-40'C(15mins) --100'C(15mins),changing time <5mins ,300CMIL-STD-202G22
Pulse Life TestTp=1ms,DC=0.1,D=Tp/T @ 3×60mA,1000Hrs/22
ESD Test(HBM)2000V,200V/Step, Forward & Reverse Test both 3times

AEC

(Q101-001)

22
Soldering Resistance

260±5℃,10S,3times

Pre-treatment 30℃,70%RH

JEITA ED-4701

300 302

22
Reflow IV Decay

260±5℃,10S,1time

Pre-treatment 30℃,70%RH,168Hrs

/22
Judgment Criteria
Forward Voltage VFVF Max-Increase < 1.1x
Reverse Current IRIR Max-Increase < IRmax
Luminous Intensity IVIV Decay < 40%
※Solder ability test criteria:coverage is not less than 95%
Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours)

 

8.Cautions:

The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the

Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.

8.1:Soldering iron :

8.1.1 When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds.

8.1.2 The hand solder should be done only one times

8.2:SMT Reflow Soldering Instructions SMT:

8.2.1 Reflow soldering should not be done more than two times;

8.2.2 When soldering , do not put stress on the LEDs during heating;

8.2.3 The recommended reflow soldering profile as following:

 

8.3 Handling Precautions

8.3.1Handle the component along the side surface by using forceps or appropriate tools;

                                                                     

8.3.2 Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry;

                        

 

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