Active Member
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[China]
Address: Bld#20,NO 88 Lingshan road ,wuzhong district,suzhou, jiangsu ,China
Contact name:Mini
Phoenix (suzhou) electronic Co.,ltd |
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Application Introduction:
The production process is to first use the graphic design software or the special software for lettering to design the content (which can be text and graphics), punch holes on the aluminum-plastic plate according to the stroke pattern interval designed in advance, and then install the light-emitting diodes in the holes + - + - + - in series
SMD led chip light boxes ads lights ,logo,sign 2835 3v red green blue yellow color
Quick details:
| Input Voltage(V): | 3V |
| Warranty(Year): | 2-Year |
| Type: | Smd Led Chip 2835 |
| Lighting solutions service: | Lighting and circuitry design |
| Luminous Efficacy(lm/w): | 60-65lm |
| Lifespan (hours): | 50000 |
| Working Time (hours): | 20000 |
| Chip Material: | INGAN |
| Emitting Color: | Red /green /blue |
| Power: | 0.5W |
| Viewing Angle(°): | 120 Degree |
| Color Rendering Index(Ra): | 80 |
| Packing bag: | 220*240nm |
| Place of Origin: | Suzhou ,jiangsu |
| Application: | Household appliances and traffic lights |
| Package Type: | Suface Mount Package |
| Forward Current: | 150MA |
| Size: | 2.8*3.5*0.65mm |
| Packing: | 4000 Pcs/Roll |
Product specification:
Package Structure:
Product Specification:
| Item | Specification | Material | Quantity |
| Chip | InGaN | InGaN | 2 in 1 |
| Reflector | White | PCT | |
| Frame | C194 | Silver-Plated Copper | |
| Gold wire | 0.9mil | Alloy | |
| Phosphor | Yellow | YAG | |
| Encapsulant | MilkyWhite | Resin | |
| Carrier tape | According to EIA 481-1A specs | Conductive black tape | 4000pcs per reel |
| Reel | According to EIA 481-1A specs | Conductive black | 4000pcs per reel |
| Label | Repsn standard | Paper | |
| Packing bag | 220x240mm | Aluminum laminated bag/ no-zipper | One reel one bag |
| Carton | Repsn standard | Paper | Non-specified |
Absolute Maximum Ratings:
| Item | Symbol | Absolute Maximum Ratings | Unit |
| Forward Current | IF | 150 | mA |
| Reverse Voltage | Vr | 5 | V |
| Pulsed Forward Current | IFP* | 180 | mA |
| Power dissipation | PD | 0.5 | W |
| Operating Temperature | TOP | -40~85 | ℃ |
| Storage Temperature | TST | -40~85 | ℃ |
| Electrostatic Discharge | ESD | 2000(HBM) | V |
| Junction Temperature | Tj | 120 | ℃ |
| LED Thermal resistance | Rth s-j | 33 | ℃/W |
Typical Electro-Optical characteristics curves:
LED Reliability Test List:
| Test Item | Test Conditions | Standard | Qty(Pcs) | Ac/Re |
| Life Test | 25℃,1000Hrs@150mA | / | 20 | 0/1 |
| High Temperature | 85℃,1000Hrs@150mA | / | 20 | 0/1 |
| Low Temperature | -40℃,1000Hrs@150mA | / | 20 | 0/1 |
| High Humidity Heat | 85℃,85%RH, 1000Hrs@150mA | / | 20 | 0/1 |
| Low Temperature Storage | -40℃,1000Hrs | JEITA ED-4701 200 202 | 20 | 0/1 |
| High Temperature Storage | 100℃,1000Hrs | JEITA ED-4701 200 201 | 20 | 0/1 |
| Temperature Cycle | (-40'C 30mins --25'C(5mins)--100'C(30mins) ,Temp changing rate:3+/-0.6'C/min) | JEITA ED-4701 100 105 | 20 | 0/1 |
| Thermal Shock | -40'C(15mins) --100'C(15mins),changing time <5mins ,300C | MIL-STD-202G | 20 | 0/1 |
Pulse Life Test
| Tp=1ms,DC=0.1,D=Tp/T @ 3×150mA | / | 20 | 0/1 |
| ESD Test(HBM) | 2000V,200V/Step, Forward & Reverse Test both 3times | AEC (Q101-001) | 20 | 0/1 |
| Soldering Resistance | 260±5℃,10S,3times Pre-treatment 30℃,70%RH | JEITA ED-4701 300 302 | 20 | 0/1 |
| Reflow IV Decay | 260±5℃,10S,1time Pre-treatment 30℃,70%RH,168Hrs | / | 20 | 0/1 |
| Judgment Criteria | ||||
| Forward Voltage VF | VF Max-Increase < 1.1x | |||
| Reverse Current IR | IR Max-Increase < IRmax | |||
| Luminous Intensity IV | IV Decay < 40% | |||
※Solder ability test criteria:coverage is not less than 95% Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours) | ||||
Packaging:
SMT Reflow Soldering Instructions SMT:
Cautions:
The encapsulated material of the LEDs is silicone. Therefore the
LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence
to the reliability of the LEDs. Precautions Should be taken to
avoid the strong pressure on the encapsulated part. So when use the
picking up nozzle,The pressure on the silicone resin should be
proper.
Soldering iron :
When hand soldering, the temperature of the iron must less than
300℃ for 3 seconds
The hand solder should be done only one times
SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following
Product features:
Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation
High brightness ,low attenuation high color rendering
Minimum 70,80,90 95 CRI options
Strong welding and good stability undead light
Product series and company logo on the front
CE ROHS LM80 Certification
Production Process:
