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LD Laser HDI PCB 380 Volt Three Phase 610x710mm

Jiangsu GIS Laser Technologies Inc.,

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Address: Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou

Contact name:Tian

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LD Laser HDI PCB 380 Volt Three Phase 610x710mm

Country/Region china
City & Province suzhou
Categories Inverters & Converters
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Product Details

laser direct imaging (LDI) system solutions HDI PCB

 

LDI for production summary

With the increasingly strict and precise alignment requirements, it is necessary to replace the traditional exposure methods. The latest developments in LDI technology, such as all requirements on mass production, can be achieved through LDI, including accuracy, output, automatic control, and traceability.

 

Although mass production of HDI boards requires high acquisition costs to purchase LDI equipment, the growing team of HDI manufacturers is now using the LDI system as the imaging method of the mass production line. The reason is simple: these manufacturers have confirmed that LDI has increased their production by at least 3% on some more complex HDI boards, and the result is that they can recover their investment within a year.


PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.


How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.

 

Specification/modelDPX230
ApplicationPCB,HDI,FPC (inner layer,outer layer,anti-welding)
Resolution (mass production)30um
Capacity30-40S@18"*24"
Exposure Size610*710mm
Panel thickness0.05mm-3.5mm
Alignment ModeUV-Mark
Alignment capabilityOuter layer±12um;Inner laye±24um
Line width tolerance±10%
Deviation increase and decrease modeFixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
Laser typeLD Laser,405±5nm
File formatGerber 274X;ODB++
Power380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7%     ~-10%
ConditionYellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
Vibration requirements to avoid violent vibration near the equipment                            


About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.

 

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