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610mmx710mm Laser Direct Imaging Equipment 30um

Jiangsu GIS Laser Technologies Inc.,

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Address: Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou

Contact name:Tian

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Jiangsu GIS Laser Technologies Inc.,

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610mmx710mm Laser Direct Imaging Equipment 30um

Country/Region china
City & Province suzhou
Categories Other Security & Protection Products
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Product Details

laser direct imaging (LDI) system solutions HDI PCB

 

 

PCB equipment directly reflects the strength and PCB production capacity of the PCB company. The use of advanced PCB equipment can improve manufacturing efficiency, improve the production accuracy, reduce labor costs and labor errors. For the production of high-end PCB such as HDI PCB, RF PCB, hybrid RF PCB, backplane PCB, embedded PCB and other complex PCB technologies, more capable PCB processing equipment must be used. These equipment are the basis for the production of high-end PCB. Only large PCB factories will invest in the introduction of high-end PCB equipment to meet the growing demand high-end PCB manufacturing needs.

 


PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.


How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.

 

Specification/modelDPX230
ApplicationPCB,HDI,FPC (inner layer,outer layer,anti-welding)
Resolution (mass production)30um
Capacity30-40S@18"*24"
Exposure Size610*710mm
Panel thickness0.05mm-3.5mm
Alignment ModeUV-Mark
Alignment capabilityOuter layer±12um;Inner laye±24um
Line width tolerance±10%
Deviation increase and decrease modeFixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
Laser typeLD Laser,405±5nm
File formatGerber 274X;ODB++
Power380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7%     ~-10%
ConditionYellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
Vibration requirements to avoid violent vibration near the equipment                            


About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.

 

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