Jiangsu GIS Laser Technologies Inc., |
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laser direct imaging (LDI) system solutions LDI Roll to Roll PCB
When a circuit board is made, the imaging process is what defines the circuit traces. While the traditional imaging process requires a photo-tool and UV-light to transfer images, LDI only uses a computer-controlled, highly focused, laser beam to directly define the circuit pattern onto the board.
PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by
what is the imaging process. Laser direct imaging ( LDI ) exposes
the traces directly with a highly focused laser beam that in NC
controlled, instead of flooded light passing through a photo tool,
a laser beam will digitally create the image.
How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface
that is positioned under a computer controlled laser. And then the
computer is creating the image on the board with the light of
laser. A computer scans the board surface into a raster image,
matching the raster image to a pre-loaded CAD or CAM design file
that includes the specifications for the necessary image intended
for the board, the laser is used for directly creating the image on
the board.
Specification/model | RTR315 |
Application | PCB,HDI,FPC (inner layer,outer layer,anti-welding) |
Resolution (mass production) | 15um |
Capacity | 12S@18"*24" |
Exposure Size | 260*800mm |
Panel thickness | 0.05mm-3.5mm |
Alignment Mode | UV-Mark |
Alignment capability | Outer layer±12um;Inner laye±24um |
Line width tolerance | ±10% |
Deviation increase and decrease mode | Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment |
Laser type | LD Laser,405±5nm |
File format | Gerber 274X;ODB++ |
Power | 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10% |
Condition | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%;
Cleanliness level 10000 and above; Vibration requirements to avoid violent vibration near the equipment |
Specification/model | DPX715T |
Application | PCB,HDI,FPC (inner layer,outer layer, ceramic wafer) |
Resolution (mass production) | 15um |
Capacity | 9S@24"*18" |
Exposure Size | 620*810mm |
Panel thickness | 0.05mm-3.5mm |
Alignment Mode | Spot-Mark |
Alignment capability | Outer layer±12um;Inner laye±24um |
Line width tolerance | ±10% |
Deviation increase and decrease mode | Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment |
Laser type | LD Laser,405±5nm |
File format | Gerber 274X;ODB++ |
Power | 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10% |
Condition | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%;
Cleanliness level 10000 and above; Vibration requirements to avoid violent vibration near the equipment |
About us
We are an innovative supplier of various PCB laser direct imaging
(LDI) system solutions. Our system product portfolio ranges from
LDI system configurations for high-mix and emerging PCB niche
applications to fully automated LDI system solutions for mass
production environments.