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0.3mm Thickness PCB Inspection Machine , Solder Paste Inspection Equipment 700mm/S

Shenzhen SMTfly Electronic Equipment Manufactory Ltd
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Address: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China 518103

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Shenzhen SMTfly Electronic Equipment Manufactory Ltd

0.3mm Thickness PCB Inspection Machine , Solder Paste Inspection Equipment 700mm/S

Country/Region china
City & Province shenzhen chongqing
Categories Electronics Production Machinery
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Product Details

0.3mm Thickness PCB Inspecting-Solder Paste Inspection Machine,SMTfly-V850 Specification:

 

CategoryItemSpecifications

Inspection System

CameraFull digital high speed CCD camera, 5 million pixels
 Light sourceRing LED light source
 FOV32mm*32mm(20μm)
 Processing time per picture<0.6s
 Test contentPaste printing / red plastic printing: volume, area, height, shape, offset, continuous tin, overflow glue
 Defect TypesYes, Offset, Multi-Tin, Less Tin, Continuous Tin, Tip, Collapse, Alien, Gold finger, Insufficient Height, Height Exceeded, Overfill, Insufficient, etc.
 Paste height range10~400um
 Paste size range0.15mm×0.15mm~10mm×10mm
 Height detection accuracy1μm (based on actual solder paste and 3D correction block)
 Repeat ability (volume/area/height)<1μm@3sigma
 Repeat ability & Reproduce ability<10%

Software System

Operating SystemMicrosoft Windows XP Professional, Windows 7
 

Identification System

Features3D bidirectional raster projection head (single head optional), no shadow 3D detection
  Operational interfaceGraphical programming, easy operation, switchable English, traditional and simplified systems
  Interface display2D/3D color map
  MARKcan select 2 common Mark points, multi-Mark function can be selected in the puzzle, and Bad Mark function is supported
 ProgrammingSupport Gerber, CAD import, support offline programming and manual programming
 SPCOffline SPCSupport
  SPC ReportAnytime Report
  Histogram/control chartVolume,area, height, offset
  Exportable Content

Reports (Excel), Pictures (jpg, bmp)

 

 

0.3mm Thickness PCB Inspecting-Solder Paste Inspection Machine Features:

 

High-precision control platform

 

The motion platform adopts servo motor and high-precision ball screw structure, and the motion is high-speed, smooth, vibration-free and noise-free.

High-precision grating scale with full closed loop feedback system.

 

High-definition, high-speed camera

 

Ultra-high frame rate industrial cameras with industrial lenses for extremely high shooting speeds; self-developed

RGB three-color light source, can realize 3D, 2D true color map, display effect is extremely close to real object;

Utilizing GPU massively parallel technology greatly improves the speed of operation and detection.

 

Ultra High Frame Rate Industrial Camera with Industrial Lens

 

Comprehensive and detailed SPC analysis system

 

SPC is the use of statistical methods for the process of the various stages of process control, through the analysis of test information feedback, to promote the improvement of the process before the process, in order to achieve the prevention of bad.

The operator can intuitively view the comprehensive statistics of test information through a pie chart or a bar chart.

Statistical information can be output in formats such as Html, Excel, or Image.

 

True color three-dimensional image

 

Phase Modulation Profilometry (PMP) is based on sinusoidal motion projection of structured gratings.

Discrete phase shift to obtain multiple illuminated object light field images, and then calculated according to multi-step phase shift method.

Out of the phase distribution, the final use of triangulation and other methods to obtain a high-precision object shape.

Contour and volume measurements. True color three-dimensional image display.

 

Red glue detection

 

This device, in addition to supporting common 3D solder paste inspection, can also detect red rubber process at the same time, supporting missed printing, overflowing plastics, multiple adhesives, and low adhesives, etc., and displaying full-color defective image. Positioning.

 

Bare-board learning programming

 

No Gerber and CAD files are required, as long as a bare board is provided, automatic learning programming can be realized. The software automatically extracts the detection frame data, and the user edits it appropriately, and sets detection parameters and allowable values.

 

Automatic plate bend compensation

 

The three-dimensional plate bending compensation technique is used to perform surface fitting on the discrete reference points in the FOV to perform real-time compensation during the detection process. There is no need to move the Z axis and the detection speed is faster.

 

Camera barcode recognition

 

The camera can automatically identify the bar code (one-dimensional/two-dimensional) of the inspection surface on the PCB to facilitate traceability of product quality.

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