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White APG Clamping Machine For Epoxy Resin And Hardener Electric Bushings

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White APG Clamping Machine For Epoxy Resin And Hardener Electric Bushings

Country/Region china
City & Province guangzhou hebei
Categories Other Mechanical Transmission Parts
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Product Details

 APG Clamping Machine For Epoxy Resin And Hardener For Electric Bushings

Hubei Jiangte offer Turn Key Project service:Cooperate customers

     1. Technique consult service

    2.APG clamping machine

    3.Mixing plant

    4.Raw material:Resin,hardener,filler etc

    5.Molds

    6.CT&PT winding machine

   7 Sample production

   8.0verseas installation and technique training

 

 

 Process data (guideline values)

General instructions for preparing liquid resin systems

Long pot life is desirable in the processing of any ARALDITE casting resin system. Mix all of the components together very thoroughly at room temperature or slightly above and under vacuum. Intensive wetting of the filler is extremely important. Proper mixing will result in:

• better flow properties and reduced tendency to shrinkage

• lower internal stresses and therefore improved mechanical properties on object

• improved partial discharge behavior in high voltage applications.

For the mixing of medium- to high viscous Epoxy casting resin systems and for mixing at lower temperatures, we recommend special thin film degassing mixers that may produce additional self-heating of 10-15 K as a result of friction. For low viscous Epoxy casting resin systems, conventional anchor mixers are usually sufficient. The prefilled Epoxy resin and Hardener can be stored at elevated temperature (about 60°C) for up to about 1 week, de-pending on formulation. Intermittent agitation during storage is advisable to prevent filler sedimentation.

 

Mixing time can vary from 0.5 to 3 hours, depending on mixing temperature, quantity, mixing equipment and the particular application. The required vacuum is 0.5 to 8 mbar. The vapour pressure of the individual components should be taken into account.

System Preparation

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

                                                                                                                                                                   

 

Application area:

 

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