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[China]
Trade Verify
Address: Building 1, Huafeng Science and Technology Park, No. 54 Guangtian Road, Luotian County community, Songgang Town, Bao'an District, Shenzhen City
Contact name:Sales Manager
ShenZhen Jieteng Circuit Co., Ltd. |
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Verified Suppliers
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If desired, we will source, organise and manage all aspects of the PCB design, so that your product meets all required standards and is fully optimised for easy and cost effective manufacturing. A well designed circuit board means: · A reduction in production problems · Improved quality control · Reduced costs · Reduced manufacturing times
| Our advantage | ||
| Material Technology | Our Production | General Production |
| Regular/Special | 1. Our (TG170)FR4: high quality materials, excellent heat resistance, won't distort break in high temperature, no foaming, no burning, good performance in electrical charge, impact resistance, humidity-resistance 2. Our FR4 good performance in electrical charge, impact resistance, humidity-resistance 3. Our CEM no-burr 4. Our Rogers Good performance in high frequency 5. Our Aluminum Excellent heat dispersion | 1.General FR4 High heat work 2.General CEM Expand and deform in damp conditions |
| Factory | We have automatic production line. The automatic production line
improves the precision and efficiency of PCB producing,it makes surface brighter, cleaner and more smooth, and it helps reduce the cost. | Artificial production line |
| Blind/buried via board, High Density Interconnect(1+1,N+1) | Application of HDI technology reducing the thickness and the volume of PCB boards, increasing the density of 3-D wiring design. | Difficult manufacturer, high cost |
| Impedance | Good performance in reliability and stability of signal sending and receiving | High cost |
| Surface Technics | 1. IMG:smooth surface, good adhesion, no oxidation under long using 2. gold plating(thick gold:1-50U"):good wear-resistance 3. HASL:better price, not easy oxidation, easy to welding, smooth surface 4. HAL: better price, not easy oxidation, easy to welding | 1.IMG:high price 2.Gold plating(thick gold):high price 3.HAL:surface is not flat, not suitable for BAG packaging |
| Copper Via/Surface(20-25UM,0.5-60Z) | Laser holing: Min 0.1MM, Mechanical holing: Min 0.2MM | Hard to reach 0.1MM |
| Multilayer board(4-20 L),BGA(CPU) | BGA: high density, high performance, multifunctional, increase
thermal reliability, good performance in electroheat property, MIN width/space: 3/3MIL Multilayer board:strong microporous, high reliability | Difficult manufacturer,high cost |
| Test | To assure quality, avoid wasting after installing and scraping, save cost, save the time of rework | Careless |
