| | FR4, (High Tg FR4, General Tg FR4, Middle Tg Fr4), Rogers High
frequency material, Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO,
PPE etc. |
| | Mass production: 394mil(10mm) Samples: 17.5mm |
| | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion
Silver, ENEPIG, Gold Finger |
| | 1200mm × 560mm |
| | Mass production: 1~58 layers / Pilot run: 64 layers, Flexible PCB:
1-12 Layers |
| | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity,
Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
| | Buried via, Blind via, Mixed Pressure, Embedded Resistance,
Embedded Capacitance, Local Mixed Pressure, Local High Density,
Back drill, impedance control. |
| | ICT,SPI,AOI online,X-ray, AOI offline, Functional Test |
| | 800Million Points/Day |
| | 0.6Million Points/Day |
| | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component
sourcing, conformal coating spraying, Plastics&Molds, finished product assembly, aging test, PCB manufacturing from 1 to
64 layers,PCB circuit design,Free DFM check,Embedded
Development,NPI trial production report.Lithium battery protection
board solve scheme, Bluetooth, wifi and other module |