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2 Inch Square Portable Black Plastic IC Chip Tray For IC Devices

Shenzhen Hiner Technology Co.,LTD

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Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN

Contact name:Rainbow Zhu

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2 Inch Square Portable Black Plastic IC Chip Tray For IC Devices

Country/Region china
City & Province shenzhen guangdong
Categories EL Products
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Product Details

2 Inch Black Plastic IC Chip Tray For IC Devices

 

ESD Black Plastic Storage Chip Tray For For Carrying IC With Different Size

 

 

Chip tray is a carrier for bare dies used for the transportation and handling of a small batch of dies. A waffle pack is typically a plastic tray with pockets sized up for a particular die size.
 
IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).

 

The Key Differences Between ESD and Anti-Static.
Anti-static have a coating or chemical additive that dissipates static across its surface so you never build up enough charge to get a shock. ESD is a much more robust solution that delivers greater long-term results because it is actually earthed

 

Hiner-pack supplies a wide range of chip trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules.

 

Our Advantages

 

1. Flexible OEM service: we can produce products according to customer’s sample or design.

2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding,Production

4. Comprehensive customer service: from customer consultation to after sales service.

5. 10 years’ex perience of OEM for USA and EU customers.

6. We have our own factory and can control quality in high level and produce products quickly and flexibly.

 

Refer to detail

Outline SizeMaterialSurface ResistanceServiceFlatnessColor
2"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.2mmCustomizable
3"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.25mmCustomizable
4"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.3mmCustomizable
Custom sizeABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMTBCCustomizable
Provide professional design and packaging for your products
Outline Line Size50.7*50.7*4mmBrandHiner-pack
ModelHN19100Package TypeIC Parts
Cavity Size2.03*2.5*0.66mmMatrix QTY12*14=168PCS
MaterialPCFlatnessMAX 0.2mm
ColorBlackServiceAccept OEM,ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateROHS

 

Product Application

 

Wafer Die / Bar / Chips                     PCBA module component

Electronic component packaging      Optical device packaging

 


Packaging Details

 

Packing according to customer's specified size

FAQ

 

Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

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