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UAV NVIDIA Xavier NX Jetson Tx2 Board For Intelligent Computing

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Beijing Plink AI Technology Co., Ltd

UAV NVIDIA Xavier NX Jetson Tx2 Board For Intelligent Computing

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Product Details

UAV NVIDIA Xavier NX Jetson Tx2 Board For Intelligent Computing

NVIDIA Development Board-Jetson Xavier NX Carrier Board Y-C7

The Y-C7 is a NVIDIA AI board that with NVIDIA Jetson Xavier NX module, it's an industrial carrier board. For industrial single board computer and the intelligent computing application of UAV industry,NVIDIA Jetson Xavier NX integrates a 128-bit wide LPDDR4x memory interface implemented as four 32-bit channels with x16 subpartitions. The memory controller provides a single read or write command, plus a row address to both sub-partitions in the channel to transfer 64 bytes. It also provides three independent column address bits to each sub-partition, allowing it access different 32-byte sectors of a GOB between the sub-partitions. It provides connections between a wide variety of clients,supporting their bandwidth, latency, quality-of-service needs, and any special ordering requirements that are needed. The MSS supports a variety of security and safety features and address translation for clients that use virtual addresses.

 

USB3.1 Type-C

1

Micro USB

1

(10 / 100 / 1000 BASE-T) RJ45

1

HDMI 2.0

1

USB 2.0

1

M.2 Key M

1

Fan Control Interface

1

MiniPCIe

1

I2C(3.3V)

1

CAN

1

RS-232

1

UART

1

GPIO(3.3V)

3

GPO(3.3V)

1

Board size

80mm * 60mm * 16.8 mm

Power supply requirements

DC + 9V~ + 24V

Operating temperature

-20~ + 65°C

Weight

40g

 
NVIDIA Jetson Xavier NX System-on-Module
Volta GPU + Carmel ARM + 8 GB LPDDR4x + 16 GB eMMC 5.1

AI PerformanceUp to 21 TOPS (INT8)
Volta GPU384 NVIDIA® CUDA® cores | 48 Tensor cores | End-to-end lossless compression | Tile Caching | OpenGL® 4.6 | OpenGL ES 3.2 | Vulkan™ 1.1 ◊ | CUDA 10
Carmel CPUARMv8.2 (64-bit) heterogeneous multi-processing (HMP) CPU architecture | 3x dual-core CPU clusters (six NVIDIA Carmel processor cores) connected by a high-performance system coherency interconnect fabric | L3 Cache: 4 MB (shared across all clusters)
AudioDedicated programmable audio processor | ARM Cortex A9 with NEON | PDM in/out | Industry-standard High Definition Audio (HDA) controller p
Memory8 GB 128-bit LPDDR4x DRAM | Secure External Memory Access Using TrustZone® Technology | System MMU
Storage16 GB eMMC 5.1 Flash Storage
Bus Width8-bit
Maximum Bus Frequency200 MHz (HS400)
Module Size69.6 mm x 45 mm | 260 pin SO-DIMM Connector
Supported Power Modes10W – 15W
Power Input5V

 
 





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