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Compact Design 400x300 / 17μm COIN Series Uncooled LWIR Thermal Imaging Camera Module
COIN417/R uncooled infrared module uses the fully optimized SWaP-C wafer level package (WLP) infrared imaging detector with 400x300 resolution and 17μm pixel size. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement.
Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing process and easier to be integrated, which is more suitable for high volume and low cost production.
The COIN417/R infrared module features in sharp and crisp thermal image presentation, compact size and low cost. Its lightweight and flexible features with various industry standard interfaces make it popular in infrared applications such as Security & Surveillance, UAV Payloads, Advanced Driver Assistant System, Firefighting, AIoT etc.
- Compact, flexible structure
- Low power consumption
- Easy integration into terminal products
- Shorten secondary development cycle
| Model | COIN417/R |
| IR Detector Performance | |
| Resolution | 400x300 |
| Pixel Pitch | 17μm |
| Spectral Range | 8~14μm |
| NETD | <40mk |
| Image Processing | |
| Frame Rate | 25Hz/30Hz/50Hz/60Hz |
| Start-up Time | ≤10s |
| Analog Video | PAL/NTSC |
| Digital Video | RAW/YUV/BT656 |
| Dimming Mode | Linear/Histogram/Mixed |
| Digital Zoom | 1~8X Continual Zoom, Step Size 1/8 |
| Image Display | Black Hot/White Hot/Pseudo Color |
| Image Direction | Horizontally/Vertically/Diagonally Flip |
| Image Algorithm | NUC/AGC/IDE/DNR |
| Electrical Specification | |
| Standard External Interface | 30pin_HRS |
| Communication Mode | RS232-TTL, 115200bps |
| Supply Voltage | 3.5~5.5V |
| Typical Power Consumption | <1.1W |
| Temperature Measurement | |
| Operating Temperature Range | -10°C~50°C |
| Temperature Measurement Range | -20°C~150°C, 100°C~550°C |
| Temperature Accuracy | ±3℃ or ±3% (Take the Maximum Value) |
| SDK | Support ARM/Windows/Linux SDK, Full Screen Thermography |
| Physical Characteristics | |
| Dimension (mm) | 25.4x25.4x14.1 (With Shutter) |
| Weight | 13g±0.5g (Without Lens) |
| Environmental Adaptation | |
| Operation Temperature | -40°C ~ +70°C |
| Storage Temperature | -45°C ~ +85°C |
| Humidity | 5%~95%, Non-condensing |
| Vibration | Random Vibration 5.35grms, 3 Axis |
| Shock | Half-sine Wave, 40g/11ms, 3 Axis 6 Direction |
| Optics | |
| Optional Lens | Fixed Focus Athermal: 9.7mm/15mm/19mm |
The COIN417/R IR camera module is widely used in Thermography, Security & Monitoring, Outdoors, Firefighting & Rescue, AIoT, Intelligent Hardware, UAV Payloads, ADAS etc.
1. What is infrared thermal imaging?
Infrared thermal imaging is a kind of method which utilizes infrared radiation and thermal energy to gather information about objects. It converts invisible infrared radiation into visible infrared thermal image with temperature distribution of the target surface. Different objects and even different parts of the same object have different radiation ability and infrared reflection strength.
2. What can infrared imaging be used for?
-Night vision
-Search & rescue
-Non-destructive test
-Epidemic prevention
-Thermography
-Security & monitoring
-Firefighting
…
3. What is thermal imaging module?
A thermal imaging module usually consists of an infrared detector, infrared lens and hardware electronics with software and algorithm embedded. It is the minimum unit of a thermal imaging device.
