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The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch

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The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch

Country/Region	china
City & Province	zhengzhou henan

Product Details

SiC ICP Tray

Silicon carbide ICP tray is formed by isostatic pressing process and sintering at high temperature. The outer diameter, thickness, number and size of acupoints, position and shape of the tablet groove can also be finished according to the requirements of the user's design drawings to meet the specific requirements of the user.

Typical applications

The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etching.

Features and advantages

Good thermal conductivity, low coefficient of expansion and temperature uniformity
Plasma impact resistance
Can be made according to the specific size requirements of customers, the maximum diameter can reach 495MM
Resistant to all kinds of strong acid and alkali chemical reagent corrosion

Specifications:Diameter 330/380mm

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