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High precision silicon carbide components for semiconductor processes and optical machinery equipment

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Address: No. 26, Dongqing Street, High-tech Zone, Zhengzhou ,Henan, China

Contact name:Daniel

HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

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High precision silicon carbide components for semiconductor processes and optical machinery equipment

Country/Region	china
City & Province	zhengzhou henan
Categories	Tool Processing Services

Product Details

High precision silicon carbide components for

semiconductor processes and optical machinery equipment

Silicon carbide robotic arm is formed by isostatic pressing process and sintering at high temperature. According to the requirements of the user's design drawings, the size, thickness and shape can be finished to meet the specific requirements of the user.

Typical applications

Used for wafer transmission in various semiconductor manufacturing processes.

Features and advantages

Accurate size and thermal stability
High specific stiffness and excellent thermal uniformity, long-term use is not easy to bend deformation;
The wafer has a smooth surface and good wear resistance, allowing safe handling of the wafer without particle contamination.
Coresic ® SP resistivity silicon carbide in 106-108 Ω, nonmagnetic, accord with the normative requirement of ESD resistance; It prevents static electricity from accumulating on the surface of the wafer.
Good thermal conductivity, low coefficient of expansion.

Specifications

According to customer's drawings, we can process different shapes and sizes of arms.

Silicon carbide vacuum chuck is formed by isostatic pressing process and sintering at high temperature. According to the requirements of the user's design drawings, the size, thickness and shape can be finished to meet the specific requirements of the user.

Typical applications

In semiconductor manufacturing, extremely thin wafers are placed on silicon carbide vacuum suckers, connected to a vacuum generator, and the wafers are fixed by vacuum suction.
Used in lithography, etching, laser processing, wafer testing and other processes.

Features and advantages

Accurate size and thermal stability
Good thermal conductivity, low coefficient of expansion and temperature uniformity
Extremely high wear resistance and surface finish, fine pore size and uniform distribution, can be uniformly adsorbed to all areas of the wafer
Excellent acid and alkali corrosion resistance
Plasma impact resistance

Specifications