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White D50 Sphercial Alumina Powder 3.60g/Cm3 Specific Gravity

HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

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White D50 Sphercial Alumina Powder 3.60g/Cm3 Specific Gravity

Country/Region china
City & Province zhengzhou henan
Categories Bromide
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Product Details

 

SPHERCIAL ALUMINA POWDER FOT HIGH THERMAL CONDUCTIVE MATERIAL

 

Sphercial Alumina Powder Fot High Thermal Conductive Material

This product is a spherical alumina powder with high globularity with high thermal conductivity, developed by high temperature melting technologies and indicates excellent characteristics for rubber and plastic filler and ceramic base material.

 

Specifications:

 

Type

D50(um)

S.S.A.(m2/g)

SA-05

5±1

0.60

SA-10

10±2

0.50

SA-20

20±3

0.40

SA-30

30±3

0.30

SA-40

40±5

0.20

SA-70

70+/-6

0.12

 

Physical Property:

 

AppearanceWhite powder
Specific Gravity (g/cm3)3.60
Melting point (℃)2050
Moisture (%)≤ 0.05
EC(uS/cm)≤ 10
PH7.0±0.5
α-Al2O3 Cotent(%)≥ 90
Spherical particles ratio(%)≥ 95

 

Chemical Property:

 

TypeChemical Composition
Al2O3% ≥SiO2% ≤Fe2O3% ≤Na2O%≤K2O% ≤MgO%≤CaO% ≤
SA-0599.00.050.050.030.020.010.01
SA-1099.00.050.050.030.020.010.01
SA-2099.00.050.050.020.010.010.01
SA-3099.00.050.050.020.010.010.01
SA-4099.00.050.050.020.010.010.01
SA-7099.00.05.050.020.010.010.01

 

 

 

Character:

 

1. High filling density: With its large particle diameter and broad particle size distribution,realizes highdensity filling for rubber and plastic and producescompounds with low viscosity and good fluidity.

2. High thermal conductivity: High filling density enables production of compounds with higher thermal conductivity and higher heat dissipation rate compared to crystalline silica.

3. Low abrasivity: Due to its Spherical shape, less-wearing of kneading machines, forming machines and dies.

 

Applications:

 

1. Filler for heat sink sheet, filler for heat dissipation board (MC board), heat dissipating

grease, phase change sheet

2. Filler for semiconductor sealing resin

3. Silicone-based heat dissipating adhesive, filler for compound

4. Ceramic filler

 

 

 

 

 

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