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Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness
HongRuiXing (Hubei) Electronics Co.,Ltd.
Last Login:14 hours 22 mins ago
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<div style=" color: #666666;font-size: 11px;left: 20px;line-height: 22px;font-family:Verdana,Arial;"><div>For the best results, we recommend including the following details:</div><ul style="list-style: none outside none;margin:0;padding:0;text-indent: 5px;"><li>-Self introduction</li><li>-Required specifications</li><li>-Inquire about price/MOQ</li></ul></div>
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