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8MHz 5V 256×1 TSL1402R​ Linear Sensor Array With Hold DIP14

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DELI ELECTRONICS TECHNOLOGY CO.,LTD

8MHz 5V 256×1 TSL1402R​ Linear Sensor Array With Hold DIP14

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City & Province shenzhen guangdong
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Product Details

TSL1402R​ #  256 × 1 Linear Sensor Array With Hold DIP14

Linear Sensor  Array 256X1   

 

 

NC − No internal connection:
256 × 1 Sensor-Element Organization
400 Dots-Per-Inch (DPI) Sensor Pitch
High Linearity and Uniformity
Wide Dynamic Range . . . 4000:1 (72 dB)
Output Referenced to Ground
Low Image Lag ... 0.5% Typ
Operation to 8 MHz
Single 3-V to 5-V Supply
Rail-to-Rail Output Swing (AO)
No External Load Resistor Required
Replacement for TSL1402
 
 
Description:
The TSL1402R linear sensor array consists of two sections of 128 photodiodes each and associated charge
amplifier circuitry, aligned to form a contiguous 256 × 1 pixel array. The device incorporates a pixel data-hold
function that provides simultaneous integration start and stop times for all pixels. The pixels measure 63.5 μm
by 55.5 μm, with 63.5-μm center-to-center spacing and 8-μm spacing between pixels. Operation is simplified
by internal logic requiring only a serial-input pulse (SI) and a clock.
The TSL1402R is intended for use in a wide variety of applications including mark and code reading, OCR and
contact imaging, edge detection and positioning, and optical encoding
 
 
MECHANICAL INFORMATION:
This assembly consists of 2 sensor chips mounted on a printed-circuit board in a clear molded plastic package.
 
 
Notes:
A. All linear dimensions are in millimeters.
B. The true-position spacing is 2.54 mm between lead centerlines. Each pin centerline is located within 0.25 mm of its true
     longitudinal positions.
C. Index of refraction of clear plastic is 1.52.
D. The gap between the individual sensor dies in the array is 57 μm typical (51 μm minimum and 75 μm maximum).
E. This drawing is subject to change without notice.
 
 
THEORETICAL PIXEL LAYOUT FOR IDEAL CONTINUOUS DIE
ACTUAL MULTI-DIE PIXEL LAYOUT FOR DIE-TO-DIE EDGE JOINING
 
 
Notes 2: 
A. All linear dimensions are in micrometers.
B. Spacing between outside pixels of adjacent die is typical.
C. Die-to-die spacing.
D. This drawing is subject to change without notice.
Figure 12. Edge Pixel Layout Dimensions
 
 
Production Data :
— information in this document is current at publication date.
Products conform to specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard warranty.
Production processing does not necessarily include testing of all parameters.
 

Deli electronics tehcnology Co.,Ltd

http://www.icmemorychip.com/

Email:sales3@deli-ic.com
Skype:hkdeli881
Contact: VIVI-CHEN

 

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