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[China]
Trade Verify
Address: No.5001,Dongji Building B, No.1 Dongji Avenue, Jiangning, Nanjing, China
Contact name:Leo Ren
High Wood Technology Development Co., Ltd |
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Verified Suppliers
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HW-HSB-M4-05DM-222X
High speed configuration available that allows data rates up to 6.250 Gb/s via 100 ohm matched impedance differential pairs.
• Partially populated standard HDB3 mother board and daugher board bodie
HSB³ HIGH DENSITY CONNECTOR FEATURES:
How to order:
| 1 | 2 | 3 | 4 | 5 | 6 | 7 |
Number of Differential Pairs | Differential Signal | Brush Wire Plating | Termination | Contact Termination Finish | Less Hardware (Purchased separately see pg XX for hardware options) | |
| HSB-M4 | -03 | D | M | 24 | 2 | X |
1. Connector Type
HSB-M4
Designates High Speed HDB3 I/O Connector
2. Number of Contacts
Number Differential Pairs | No. Low Speed Signals | Dimension A | Dimension C |
| 03 | 20 | 1.375 | 1.075 |
| 05 | 30 | 1.725 | 1.425 |
| 07 | 40 | 2.075 | 1.775 |
| 10 | 60 | 2.775 | 2.475 |
| 13 | 80 | 3.475 | 3.175 |
3. Differential Signal
| D | Standard |
4. Brush Wire Plating
| M | 0.000050 Au Min. thick over Nickel |
| C | 0.000020 Au Min. thick over Nickel |
5. Termination
| Type | Stickout (Dim. E) | |
| 22 | PCB, Straight, .016 Dia | 0.120 |
| 23 | PCB, Straight, .016 Dia | 0.150 |
| 24 | PCB, Straight, .016 Dia | 0.180 |
| 26 | PCB, Straight, .016 Dia | 0.240 |
| 28 | PCB, Straight, .016 Dia | 0.300 |
6. Contact Termination Finish
| 2 | Gold plated in accordance with MIL-G-45204, Type II, .000030 Min. thick Gold over .000050 Min.thick Nickel |
| 5 | Tin plated in accordance with ASTM B545, .00010 Min. thick Matte Tin over .00010 Min. thick Nickel |
| 6 | Tin-Lead plated in accordance with SAE-AMS-P-81728, .00010 Min. thick Tin-Lead over .00010 Min. thick Copper |
| X | Less Hardware |
Product pictures:
HDB³ & HSB³ HIGH DENSITY CONNECTOR PERFORMANCE:
| Durability: | 100,000 mating cycles |
| Insertion/Extraction Force: | 1.5 ounce typical per contact |
| Operating Temperature: | -65° to 125°C |
| Current Rating: | 2 amperes Hot swap 1 ampere maximum (load dependent) |
| Insulation Resistance: | 5 gigaohms minimum |
Dielectric Withstanding Voltage: | 750 volts, 60 hertz, rms @ Sea Level, 250 volts, 60 hertz, rms @ 70,000 feet elevation |
| Solderability: | MIL-STD-202, Method 208 |
| Salt Fog: | 48 Hours IAW MIL-STD-1344, method 1001, test condition B |
| Humidity: | IAW MIL-STD-1344, method 1002, type II |
| Vibration: | 4 hours in each of 3 mutually perpendicular axes IAW MIL STD-1344, method 2005, test condition V, letter H |
| Shock: | 1 shock along each of three mutually perpendicular axes IAW MIL-STD-1344, method 2004,test condition G |
| Data Rate (HSB3 ): | Capable of up to 6.250 Gbps (consult Amphenol for arrangement) |
MATERIALS:
| Insulator: | Liquid crystal polymer, 30% glass filled | |
| Contact: | Wire | Beryllium copper per ASTM B197; finish is gold per ASTM B488 over nickel per AMS-QQ-N-290 |
| Holder: | Brass similar to UNS C33500; available finishes include gold per MIL-G-45204, tin-lead per MIL-P- 81728 or tin per MIL-T-10727 (RoHS Compliant) | |
| Sleeve: | Stainless steel per AMS-5514, passivated IAW QQ-P-35 (Daughter board, I/O and Stacker connector) | |
