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Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer

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Topmatch Electronics (Suzhou) Co., Limited.

Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer

Country/Region china
City & Province suzhou jiangsu
Categories Home Product Making Machinery Parts
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Product Details

0.3pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board

 

A burn-in board is a printed circuit board that is used in the burn-in process.

The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.

 

During the burn-in process extreme temperatures often ranging from 125°C – 250°C or even 300°C are applied so the materials used need to be extremely durable. Generally speaking we use IS410 for applications up to 155°C and polyimide for applications up to 250°C. For temperatures over 250°C a higher grade of polyimide is used. We also use high temperature lead free solders and stainless-steel board fixtures.

1 . Descriptions:

 

What is a BIB ?

 

A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.

 

2 . Specifications:

 

Name0.3pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards
Number of Layers8
Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
MaterialIT180
Thickness0.8mm
Min Track/Spacing75um/75um
Min Hole SizeLaser 75um
Solder MaskGreen
SilkscreenWhite
Surface FinishImmersion gold + OSP
Finished Copper12um
Production time10-21 working days
Lead time2-3 days

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