Active Member
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[China]
Address: Room 301, Building 1, Shahu Science and Technology Park, SIP, SUZHOU City,Jiangsu Province,P.R.C
Contact name:Jerry He
Topmatch Electronics (Suzhou) Co., Limited. |
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4Layer Rigid-flex PCB for Electronic cigarette mainboard
For the first sample order, we find several problem as follows:
1. The connected Bluetooth display does not respond to the green light.
2. USB only recognizes one side
3. The wire inside the product is too long to completely close the case.
4. The shell design has less buckle function and needs to be temporarily tied with rubber bands.
5. The motor has a lot of bad contact
6. Connect the wrong type hardware.
7. After connecting the battery, several parts short circuit
Rigid-flex PCB can be used in consumer electronics, and meet 3D assembly requirement of products with specific flexible bending area design, .
Specifications:
| Name | 4Layer Rigid-flex PCB for Electronic cigarette mainboard |
| Layers | 4 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | DS-600D |
| Min Track/Spacing | 75um/100um |
| Drilling Size | 100um |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold |
| Finished Copper | 1/3OZ |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
| Capability | Standard | Advanced | Capability | Standard | Advanced | Capability | Standard | Advanced |
| Line width space | 2.36/2.36mil | 2.0/2.0mil | Nath Aperture size | ±2mil | ±1.5mil | Min. SMT/QFP Pitch | 10mil | NA |
| Max Copper foil thickness | 2oz | 4oz | Hole location Accuracy | ±3mil | ±2mil | Min. BGA Pitch | 12mil | NA |
| Min. via hole size | Min:0.2mm | Min:0.15mm | Distance from the center of the hole to the center of the hole | ±4mil | ±3mil | Max. Test Points/Board(Universal ET) | Bed of Nail Test:16000 | NA |
| Min. blind hole size | Min:0.1mm | Min:0.05mm | Hole to Edge Precision | ±3mil | ±2mil | Flying Probe Test:1-∞ | ||
| Minimum semi-metalized hole | Min:0.45mm | Min:0.40mm | Layer to layer registration | ±4mil | ±3mil | v-cut Depthing | ±4mil | ±3mil |
| Buried hole | 4-16 layer | 24 layer | Shape Size tolerance | ±4mil | ±3mil | v-cut Angel | 20°,30°,45° | NA |
| Max production board size | 520mmX620mm | 540mmX640mm | Impedance tolerances | ±10% | ±8% | v-cut precision | ±4mil | ±3mil |
| Max Aspect ratio | 8:01 | 10:01 | Min. Solder Mask Dam Width | Green Oil:3mil | Green Oil:2.5mil | |||
| line width space | ±20% | ±10% | Other:4.5mil | Other:4mil | ||||
| Pth Aperture size | ±3mil | ±2mil | S/M Registration | ±1.5mil | ±1.2mil |
| Surface Finishes |
| Electroless Nickel Immersion Gold (ENIG) |
| Hot Air Solder Level (HASL, Lead and Lead‐free) |
| OSP, Immersion Tin,Immersion Silver, ENEPIG |
| Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold |
| Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM |
