CCL Fr4 High Tg Pcb Multilayer Circuit Board Design High Frequency

High TG CCL 8Layer main board using in electric power

The main reason for using different materials to create multilayer PCBs is to limit poorer mechanical and structural properties found in some laminates by combining them with the superior characteristics offered by others. For example, PTFE has excellent electrical characteristics yet can experience structural integrity issues at certain temperatures. To offset this disadvantage, a fabricator can combine polyimide into the layers because of its better mechanical properties.

Another reason to use a combination of materials is to cut down on costs while still gaining the necessary high performance when it is necessary. FR-4 and PTFE will often be combined with hybrid designs. The low costs of advantages allow for the FR-4 to provide adequate benefits for low speed applications, while the PTFE will be used for more critical PCB functions. In addition, FR-4 may be used to even out thickness issues for the laminate layers. It can be added in certain places to act as the glue to hold everything together and to provide a more even printed circuit board.

Hybrid multilayer PCBs often make use of circuit materials with very different values of dielectric constant (Dk). For example, some multilayer antenna circuits may consist of a low-Dk circuit material as the outside layer for radiating elements, a moderate-Dk circuit material internally for a stripline antenna feed line, and a high-Dk material for an internal layer for filter circuitry. The different Dk materials are often based on different resin systems. The outer, low-Dk layer may be PTFE material while the inner, moderateDk circuit layer is formed on a ceramic-filled hydrocarbon-based laminate. The bonding materials could be based on either type of material, although hydrocarbonbased bonding materials are more often used for their ease of circuit fabrication.

2 . Specifications:

3. Product application

Printed circuit boards (PCBs) with characteristic impedance control are widely used in high frequency circuit. PCB's that mixed high frequency material can reduce signal loss at high frequencies and meet the development needs of communication technology.

It is mainly used in the infrastructure field of transmission cores including WDM/OTN end-to-end intelligent optical transmission platform, MSTP/multi-service transmission platform, microwave fusion transmission radio frequency, data communication system platform, and other information communication industries.