Active Member
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[China]
Address: Rm1104, No.17 Lane 6 Huangjinshan Community, Bantian Street, Longgang District, Shenzhen
Contact name:angelina
Shenzhen Hengxunda Circuit Technology Co.,LTD |
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| Process Capability - Technical Parameters(FPC) | |||||
| Content | Common | Special | Surface treatment | Thickness | |
| Minimum line width | 0.07mm | 0.05mm | Electroplated nickel gold | Ni:3-9um;Au:0.03-0.1um | |
| Minimum line spacing | 0.07mm | 0.05mm | |||
| Minimum Drilling aperture | Φ 0.15mm | Φ 0.1mm | |||
| Aperture Tolerance | ±0.1mm | ±0.05mm | Chemical immersion gold | Ni:3-5um;Au:0.03-0.1um | |
| Maximum imposition size (single panel) | 610mm*1200mm(Exposure limit) | 250mm*35mm(only develop test samples) | |||
| Maximum imposition size (double panel) | 610mm*1200mm(Exposure limit) | 250mm*35mm(only develop test samples) | |||
| Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) | 610*1650mm | Electroplated hard gold | Ni:2-9um;Au:0.1-0.3um | ||
| Finished board impedance tolerance | ±10% | Electroplated pure tin | Sn:3-7um | ||
| Maximum production layer | 12L | ||||
| Thickness To Diameter Ratio | 2:1(Minimum aperture 0.1mm) | ||||
| 5:1(Minimum aperture 0.2mm) | Anti-oxidation | ||||
| 8:1(Minimum aperture 0.3mm) | |||||
| Monthly production capacity/m² | 16000 m² | ||||
| Material | |||||
| Substrate Material | PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) | ||||
| Conductive Medium | Copper foil(1/3oz,1/2oz,1oz,2oz) | ||||
| Constantan | |||||
| Silver Paste | |||||
| Copper Ink | |||||
| Adhesive | Epoxy resin, Acrylic, Adhesion | ||||
| Solder Mask / Protective Film | PI(0.5mil,1mil,2mil)(Yellow, White, Black) | ||||
| PET(1mil,2mil) | |||||
| Solder mask (green, yellow, black...) | |||||
| Glue | 3M467,3M468,3M9077,TESA8853... | ||||
| Reinforcement Type | PI,FR4,PET,Steel,Aluminum... | ||||
