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Al2O3 Alumina Ceramic Substrate Diameter 150mm High Corrosion Resistance

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Al2O3 Alumina Ceramic Substrate Diameter 150mm High Corrosion Resistance

Country/Region china
City & Province shanghai shanghai
Categories Steel Sheets
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Product Details

6inch 1.0mm  polished Aluminum  Al2O3 Ceramic Substrate, High Thermal Conductivity, Customized Al2O3 Ceramic,6inch ceramic substrates

 

A2O3 Introduce

 Al2O3 substrate is the most popular ceramic substrate, with excellent heat resistance,
high mechnical strength , abrasion resistance and small dielectric loss .
The surface of alumina substrate is quite smooth and low porosity , 99.6% alumina substrate
is suitable for thin film device , 96% alumina substrate is suitable for thick film device application.

Surface Finishing Level: 
a) Normal polish Ra 0.8-1.0μm
b) Fine polish Ra <5nm
c) Diamond polish Ra <1nm
Properties:

1. High Temperature Up to 1700℃

2. High Voltage Resistance

3. High Mechanical Strength and Hardness

4. Excellent Insulation Performance

5. High Corrosion Resistance

6. Extremly Abrasion Resistance Performance

7. Wide Scope of Application

 

PropertiesUnitsAlumina(Al2O3)
PorousMulliteAl2O3 92%

Al2O3

96%

Al2O3 99%Al2O3 99.6%
Al2O3
MechanicalDensityg/cm3 2.83.63.73.93.9
Color————TanWhiteWhiteIvoryIvory
Water Absorption% 00000
Vickers HardnessGpa——7.41111.51314
Flexural Strength (20°C)Mpa50~100170345358380380
Compressive Strength (20°C)Mpa20~1005502200230030003000
ThermalThermal Conductivity (20°C)W/m.K3.13.516.724.825~3525~35
Thermal Shock Resistance (20°C)ΔT(C)——300250250200200
Maximum Use Temperature°C190017001500160017001700
ElectricalVolume Resistivity (25°C)Ω.cm——>1014>1014>1014>1014>1014

Al2O3 Ceramic Feature & Advantagement

- Product Name:Alumina / Al2O3 Ceramic Substrate For Thick Film Circuit / 5.5''x7.5''
- Material:96% Alumina
- Typical Characteristics:

1. Excellent Electrical Insulation

2. Good Thermal Shock Resistance

3. Corrosion Resistance

4. Good Flatness

- Typical Applications:

1. Thick Film Hybrid Integrated Circuit

2. Ceramic Radiating Base for LED

3. Power Module

4. Semiconductor Device

Application:

Electronical Vacuum decices, Cruibles, Insulation plates, Capacitors, Spaceflights, Traffic,

Weave, Petro Chemical, Mine, Pharmaceutical Engineering, Communication Engineering

and Archtectural, etc.

​Our cooperating factory can applied the casting-tape process for the manufacturing of

alumina substrate. With good thermal conductivity, insulation, thermal shock resistance,

well resistance and anti-acid and

alkali etc., our ceramic substrates can be used in thick-film hybrid integrated circuits (HIC),

LED ceramic radiating base, power module, semiconductor devices and other fields.

We applied the casting-tape process for the manufacturing of alumina substrate.

With good thermal conductivity, insulation, thermal shock resistance, well resistance and

anti-acid and alkali etc., our ceramic substrates can be used in thick-film hybrid integrated

circuits (HIC), LED ceramic radiating base, power module, semiconductor devices and other fields.

Regular Size
Thickness(mm)                                       lengthx width ( mm)
0.385

 

       2″* 2″

50.8mm*50.8mm

 

 

          3″* 3″

76.2mm*76.2mm

 

            4″* 4″

101.6mm*101.6mm

              4.5″* 4.5″

    114.3mm*114.3mm

0.5
0.635
1.0
                                           diameter(mm)
1.0

Φ16

Φ19

Φ20

Φ26

Φ30

Φ35

Φ40

Φ45

Φ50

Φ52

Φ60Φ75Φ80
1.2
1.5
2.0
2.5
            
Diameter (mm)Thickness (mm)

2'' 

(50.8mm )

OF 16mm

3'' 

(76.2mm)

OF22mm

4''

(100mm)

OF 30mm

5“

(125mm)

OF 42.5mm

6"

(150mm)

OF 47.5mm

0.385
0.5
0.65
1.0

 

 

 

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