Active Member
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[China]
Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Contact name:karen
Shenzhen Xinchenger Electronic Co.,Ltd |
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4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board
Fabrication
Quick detail:
| Surface: Lead free HASL | Layer number:4 |
| Special technology:blind hole | Hole:PTH |
| Origin:China | Model:XCEF |
Specification
PCB Type: | multilayer PCB |
Layer : | 4 layer |
Min .Line Width/Space: | 3mil/3mil |
Min. Via Diameter: | 0.3mm |
Finish Thickness: | 0.2mm |
Surface Finish: | ENIG |
Size: | 10*9MM |
Material: | fr4 |
Color: | blue |
Application: | telecommunication |
Parameter
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating | ||||||||
High frequency PCB Introduce:
| Model | Parameter | thickness(mm) | Permittivity(ER) |
| F4B | F4B | 0.38 | 2.2 |
| F4B | 0.55 | 2.23 | |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
| F4Bk | 0.8,1.5 | 2.65 | |
| F4B | 0.8 | 3.5 | |
| FE=F4BM | 1 | 2.2 | |
| Rogers | RO5880 | 0.254 0.508 0.762 | 2.20 ± 0.02 |
| RO4350 | 0.254 0.508,0.8,1.524 | 3.5 | |
| RO4003 | 0.508 | 3.38 | |
| TACONIC | TLF-35 | 0.8 | 3.5 |
| TLA-6 | 0.254,0.8,1,1.5, | 2.65 | |
| TLX-8 | 0.254,0.8,1,1.6 | 2.55 | |
| RF-60A | 0.64 | 6.15 | |
| TLY-5 | 0.254,0.508,0.8 | 2.2 | |
| TLC-32 | 0.8,1.5,3 | 3.2 | |
| TLA-35 | 0.8 | 3.2 | |
| ARLON | AD255C06099C | 1.5 | 2.55 |
| MCG0300CG | 0.8 | 3.7 | |
| AD0300C | 0.8 | 3 | |
| AD255C03099C | 0.8 | 2.55 | |
| AD255C04099C | 1 | 2.55 | |
| DLC220 | 1 | 2.2 |
Description:
A dielectric material is a substance that is a poor conductor of
electricity, and used as an insulating layer in the PCB build up.
Porcelain, mica, glass, plastics and some metal oxides are good
dielectrics. The lower the dielectric loss, (the proportion of
energy lost as heat) the more effective the dielectric material. If
the voltage across a dielectric material becomes too great -- that
is, if the electrostatic field becomes too intense -- the material
will suddenly begin to conduct current. This phenomenon is called
dielectric breakdown.
Our high density circuit boards have the technology pushing capabilities to drive applications in a
large number of industries including but not limited to semiconductor test equipment, defense,
medical and aerospace.
