Active Member
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[China]
Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Contact name:karen
Shenzhen Xinchenger Electronic Co.,Ltd |
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High TG 180 PCB Printed Circuit Boards With ITEQ / ISOLA IT180A Material Laminate
Application:
Automobile
Backplanes
Servers and Networking
Telecommunications
Data Storage
Heavy Copper Application
Specification:
| Base Material: Isola 420 |
| Layer:2 |
| Thickness: 0.6MM |
| Copper weight:2OZ |
| Surface finish: ENIG |
Key Features
Advanced High Tg Resin Technology
Industrial standard material with high Tg (175℃ by DSC) multifunctional epoxy resin and excellent thermal reliability.
Lead-Free Assembly Compatible
RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃.
Friendly Processing and CAF Resistance
Friendly PCB process like high Tg FR4. Users can short the learning curve when using this material.
CAF Resistance
Low thermal expansion coefficient (CTE) helps to excellent thermal reliability and CAF resistance providing long-term reliability for industrial boards and automobile application.
Available in Variety of Constructions
Available in a various of constructions, copper weights and glass styles, including standard(HTE), RTF and VLP copper foil.
Parameter:
| Layer No. | 1-16 | ||||||||
| Min board thickness | 2 layer 0.2mm | ||||||||
| 4 layer 0.4mm | |||||||||
| 6 layer 0.6mm | |||||||||
| 8 layer 0.8mm | |||||||||
| 10 layer 1.0mm | |||||||||
| Max panel size | 508*610mm | ||||||||
| Board thickness tolerance | T≥0.8mm±8%,T＜0.8mm±5% | ||||||||
| Wall hole copper thickness | ＞0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
| NPTH aperture tolerance | ±0.05mm(2mil) | ||||||||
| Hole site deviation | ±0.05mm(2mil) | ||||||||
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
