Active Member
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[China]
Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Contact name:karen
Shenzhen Xinchenger Electronic Co.,Ltd |
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Customized 2-28 layers high frequency multilayer pcb circuit board maker
Specification:
Layer | 10 | Brand | XCE |
Board THK | 1.6mm | Model | XCEM-1 |
Surface finish | Immersion gold | Size | 10*6cm |
Copper THK | 3OZ | Origin | China |
Quick detail:
Application:
High technology field such as professional electronic equipment (computers, military equipment)
Aerospace communication and so on.
Description:
Xinchenger Electronics co.,Ltd established in 2009,we have commited ourselves to manufacturing various
of hi-frequency microwave pcb and multi-layer board including fastest sample production.
we have accumulated abandunt experiences in the line of high frequency microwave business for
which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,
4G antena so on and so forth.our company's sufficient stocks of hi-frequency pcb materials such as
Rogers,
TACONIC,Arlon,Isola,F4B,TP2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies
like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers
with high quality.furthermore,we also keen on helping customers shorten the period of production
development and 24 hours of sample service is available.
Parameter:
Layer | 2 to 28 layers |
Material type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
Board thickness | 1.6mm |
Copper thickness | 0.5 OZ to 7.0 OZ |
Copper thickness in hole | >25.0 um (>1mil) |
Size | - Max. Board Size: 23 × 25 (580mm×900mm) |
- Min. Drilled Hole Size: 3mil (0.075mm) | |
- Min. Line Width: 3mil (0.075mm) | |
- Min. Line Spacing: 3mil (0.075mm) | |
Surface finishing | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
Tolerance
| - Shape tolerance: ±0.13 |
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
Certificate | UL, ISO 9001, ISO 14001 |
Special requirements | Buried and blind vias+controlled impedance +BGA |
Profiling | Punching, Routing, V-CUT, Beveling |
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products. | |
Advantage:
Sufficient rogers material raw,promopt response and delivery time.
Crossed blind vias is available
