Single Side Metal Clad PCB Heavy Copper Backed PTFE / Micorowave Printed Circuit Board

Metal Clad Single Sided PCBs Backed PTFE / Micorowave Circuits Maker

Description:

Technical Details:

    Material: copper basis
    layer count: 1-26L
    Board thickness: 0.2-3.2mm
    Finishing copper thickness: 0.5-4oz
    Solder mask:green
    Silkscreen:white
    Surface Finish: OSP
    Flying probe testing: 100%pass
    Minimum hole size: 0.2mm
    Minimum track width/space: 0.25/0.25mm
    Certificates: UL,SGS,ISO9001:2008

Advantage:

• Blind and/or buried vias
• Via-in-pad
• Through vias from surface to surface
• 20 um circuit geometries
• 30 um dielectric layers
• 50 um laser vias
• 125 um bump pitch processing

FR4 (Tg – 135C, 145C, 170C)
    Rogers Ultralam 2000
    Rogers RO4350
    Rogers RO4003
    Polyimide
    Teflon
    Black FR4
    Getek Copper
    Clad Thermal Substrates
    Hybrid (Rogers and FR4)
    BT Epoxy
    Nelco 4013

HASL – Leaded Solder Tin/Nickel  
    HASL – Lead Free Solder
    Electroless Soft Gold
    Wire Bondable Soft Gold
    Nickel Flash Gold
    Electroless Nickel 
    Immersion Gold OSP 
    Electrolytic Nickel /Hard Gold and Selective Gold
    Immersion Silver
    Immersion Tin
    Carbon Ink
    ENIG

 Layer: 1 to 36 layers
    Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    Board thickness: 0.21mm to 3.4mm
    Copper thickness: 0.5 OZ to 4 OZ
    Copper thickness in hole: >25.0 um (>1mil)
Size:
    - Max. Board Size: (580mm×1200mm)
    - Min. Drilled Hole Size: 4mil(0.1mm)
    - Min. Line Width: 3mil (0.075mm)
    - Min. Line Spacing: 3mil (0.075mm)

   Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold,          OSP, Gold plating
   Solder Mask Color: Green/Yellow/Black/White/Red/Blue