F4B High Frequency Green Rigid PCB Service Custom Multi Layer HF PCB Boards 0.6mm

Materia raw

F4B high frequency

Board THK

0.6mm

Layer

6

Solder mask

Green 

Surface finish

Immersion gold

Line space

0.1mm

Copper THK

1OZ

Line width

0.1mm

XCE PCB technical specifications

Material

F4B

Layer No.

6

Min board thickness 

2 layer0.2mm                                                                 

4 layer0.4mm                                                                    

6 layer 0.6mm                                                                

8 layer 0.8mm                                                               

10 layer 1.0mm

Max panel size

508*610mm

Board thickness tolerance

T≥0.8mm±8%.,T<0.8mm±5%

Wall hole copper thickness

>0.025mm(1mil)

Finished hole

0.2mm-6.3mm

Min line width

4mil/4mil(0.1/0.1mm)

Min bonding pad space

0.1mm(4mil)

PTH aperture tolerance

±0.075mm(3mil)

NPTH aperture tolerance

±0.05mm(2mil)

Hole site deviation

±0.05mm(2mil)

Profile tolerance

±0.10mm(4mil)

Board bend&warp

≤0.7%

Insulation resistance

>1012Ωnormal

Through-hole resistance

<300Ωnormal

Electric strength

>1.3kv/mm

Current breakdown

10A

Peel strength

1.4N/mm

Soldmask regidity 

>6H

Thermal stress

288℃20Sec

Testing voltage

50-300V

Min buried blind via

0.2mm(8mil)

Outer copper thickness

1oz-5oz

Inner cooper thickness

1/2 oz-4oz

Aspect ratio

8:1

SMT min green oil width

0.08mm

Min green oil open window

0.05mm

Insulation layer thickless

0.075mm-5mm

Taphole aperture

0.2mm-0.6mm

Special technology

Indepedance,Blind buried via,thick gold,aluminum PCB

Surface finish

HASL,Lead free HASL,Immersion Gold, Immersion Tin, 

Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating