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Automotive Radar Detector High Frequency PCB Manufacturing Process With Sensor Module

Shenzhen Xinchenger Electronic Co.,Ltd
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Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China

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Shenzhen Xinchenger Electronic Co.,Ltd

Automotive Radar Detector High Frequency PCB Manufacturing Process With Sensor Module

Country/Region china
City & Province shenzhen guangdong
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Product Details

Automotive Radar Detector High Frequency PCBs  With Sensor Module

 

 

Specification:

 


Board size: 32*16 cm                                              

                

Board thickness: 0.2mm

 

Copper foil: 50UM

 

Layer: 4

 

 

Parameter:

 

F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
 

 

Description:

 

High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.

 

 

Max panel size508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)

 

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