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2 Layer High Density FR4 PCB 1.526MM Thickness Immersion Gold Board 57 * 118MM

Shenzhen Xinchenger Electronic Co.,Ltd
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Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China

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Shenzhen Xinchenger Electronic Co.,Ltd

2 Layer High Density FR4 PCB 1.526MM Thickness Immersion Gold Board 57 * 118MM

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

2 Layer High Density FR4 PCB 1.526MM Thickness Immersion Gold Board
 
specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )
 
Description:
 
Standard products(4, 6 layers), FR4, photo-sensitive soldermask
Special types (thick copper, thin core, hard gold, etc)
High layer count(8-40 layers)
High Density Interconnection (HDI): micro-via technology, build-up construction, laser holes, very small tracks, etc…
Low cost CPTH: polymer conductive holes with copper paste. 4 layers, FR4
Back panels: thick PCBs, press-fit technology, large size PCBs.
 
 
Parameter:
 

Product nameFR4 PCBDouble side4 layer6 layer8 layer10-28layer
layerSingle sideDouble side4 layer6 layer8 layer10-28layer
Base MaerialFR4FR4,Alu,polymideFR4FR4FR4FR4
Copper thickness1-6OZ
Min.Hole size0.1mm
Min.Line Width0.1mm
Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder masker colorgreen,red,black,white,yellow
Silkscreen colorblack,white,yellow
Tolerance- Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Special requirementsBuried and blind vias+controlled impedance +BGA

 

 

 

Layers1-16 layersMin Board Thickness(2-layer)0.2mm
Max Board Size635 × 1100mmMin Board Thickness(4-layer)0.6mm
Min Board Size20 × 30mmMin Inner-layer Thickness0.1mm
Min Trace0.1mmMin Annular Ring0.1mm
Min Space0.1mmMin Hole Location Tolerance±0.075mm
Min Hole Size0.2mmMin Hole Size Tolerance±0.05mm
Board Warp≤ 1°Min Outer Dimension Tolerance±0.1mm
Solder MaskGreen, Yellow, Red, Black, Blue, White
Surface FinishHAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board MaterialFR-4, High Tg FR-4, Thick Copper FR-4, Rogers, Taconic
Acceptable fileGerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD
CAM softwareGenesis, CAM350

 
Description
 
1. Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
 
 
Advantages:
 
1) We have professional research team.
2) No MOQ,small order are aslo welcome,From Prototype to Mass production.
3) All products are 100% tested working before sent to you.
4) One stop PCB solution
5) We have professional sales team, so please do not hesitate to contact us if you have any question
 
 
 

Our Services

1. Your inquiry related to our product & price will be replied within 24 hours.
2. Well-trained & experienced staff are to answer all your inquiries.
3. Customized solution & perfect after-sale service.
4. Our advantage:A.Competitive price
B.Good quality
C.Timely delivery
D.New model launch weekly
E.Own manufacturing
F.Own quality control
 
 
What we need:
* Gerber files of the bare PCB
* Bill of materials to include: Manufacturer's part number, type of part, type of packaging,
component locations listed by reference designators and quantity
* Dimensional specifications for non-standard components
* Assembly drawing, including any change notices
* Final test procedures (if available)




























































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