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F4B 2 Layer 1.6mm High Frequency PCB Board For Mission Critical Electronic Systems

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F4B 2 Layer 1.6mm High Frequency PCB Board For Mission Critical Electronic Systems

Country/Region china
City & Province shenzhen guangdong
Categories Power Accessories

Product Details


F4B 2 Layer 1.6mm High Frequency Board Circuit boards For Mission Critical Electronic Systems



High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

High frequency materials are UL 94V-0 rated for active devices and high power RF designs.




(1) F4BK225 mixed-compression PCB
(2) 4L high frequency pcb
(3) POS blind hole plate
(4) Professional PCB Manufacturer with 10 years' experience





Brand: XCE
Model: XCEH
Board size: 6*15.9cm
Cu thickness: 35UM
Material: F4B
Min line space&width: 5Mil


F4B 2 Layer 1.6mm High Frequency Board Circuit boards For Mission Critical Electronic Systems
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting





Raw MaterialF4B
Layer Count2-Layer
Board Thickness1.6mm
Copper Thickness35UM
Surface FinishImmerison Silver
Solder Mask/
Min. Trace Width/Spacing0.075/0.075mm
Min. Hole Size0.25mm
Hole Wall Copper Thickness≥20μm
PackagingInner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
AdvantageCompetitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special RequirementsBuried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable

Reference - our production capability for rigid PCB:
Layers: 1 to 28
Board finished thickness: 0.2 to 7.0mm
Materials: FR4,Rogers,Taconic
Max. finished board size: 23 x 25 (580 x 900mm)
Min. drilled hole size: 3mil (0.075mm)
Min. line width: 3mil (0.075mm)
Min. line spacing: 3mil (0.075mm)
Surface finish/treatment : HASL/HASL lead free,HAL, Chemicaltin, chemical gold
Immersion Silver/gold,OSP, gold plating
Copper thickness: 0.5-7.0oZ
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0μm (>1mil)
Inner packing: Vacuum packing/plastic bag
Outer packing: Standard carton packing
Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificates: UL, ISO 9001, ISO 14001, SGS, RoHS
Special requirements: buried and blind Vias + controlled impedance + BGA
Profiling: Punching, routing, V-CUT, beveling
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products





XCE PCB technical specifications
Layer No.2
Min board thickness

2 layer0.2mm

4 layer0.4mm

6 layer 0.6mm

8 layer 0.8mm

10 layer 1.0mm

Max panel size508*610mm
Board thickness toleranceT≥0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness>0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300V
Min buried blind via0.2mm(8mil)
Outer copper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickless0.075mm-5mm
Taphole aperture0.2mm-0.6mm
Special technologyIndepedance,Blind buried via,thick gold,aluminum PCB
Surface finish

HASL,Lead free HASL,Immersion Gold, Immersion Tin,

Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating



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