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One Layer Single Sided PCB Circuit Boards With High Frequency Laminate

Shenzhen Xinchenger Electronic Co.,Ltd
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Shenzhen Xinchenger Electronic Co.,Ltd

One Layer Single Sided PCB Circuit Boards With High Frequency Laminate

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

One Layer Single Sided PCB Circuit Boards With High Frequency Laminate

 

 

 

Quick detail:

  
LayerSingle Layer
MaterialFR4
Board Thinckness1.2MM
Size12*9CM
Solder MaskGreen
SilkscreenWhite
Finish Copper Thinckness35μm/35μm
Surface FinishHASL
Board Thinckness Tolerance±10%
Impedance Control±10%
Warp & Wist0.70%
Testing100% Electric Test, IPC Class II.

 

 

Specification:

1 Layer Black Soldermask Immersion Gold High TG PCB Board In Panel Format

FR-4 material is a fire code rating, represents a material specification is meant a resin material through the combustion state must be self-extinguishing, it is not a material name, but a material grade. So now FR-4 grade material is typically used in circuit boards, there are many species, but most are based on the so-called four-function (Tera-Function) plus epoxy filler (Filler) and glass fiber made composite materials.

 

Defined impedance 4 layer black soldermask immersion gold board is: a good laminated structure will be able to play on the printed circuit board characteristic impedance control, the traces can be formed easily controlled and predictable transmission line structure is called impedance plate.

 

Current common characteristic impedance is divided into: single-ended (line) impedance differential (fixed) impedance coplanar impedance.

Single-ended (wire) Impedance: English single ended impedance, refers to a single signal line measured impedance.

Difference (Fixed) Impedance: English differential impedance, differential drive means to the test in two monospaced equally spaced transmission line impedance.

Products Details

Raw MaterialFR-4 (Tg 130 available)
Layer CountSingle Sided
Board Thickness1.2mm
Copper Thickness1.0oz
Surface FinishENIG(Electroless Nickel Immersion Gold)
Solder MaskGreen
SilkscreenWhite
Min. Trace Width/Spacing0.075/0.075mm
Min. Hole Size0.25mm
Hole Wall Copper Thickness≥20μm
Measurement300×400mm
PackagingInner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
ApplicationCommunication,automobile,cell,computer,medical
AdvantageCompetitive Price,Fast Delivery,OEM&ODM,Free Samples,

 

XCE PCB technical specification
Annual stock meterialRogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No.1-16
Min board thickness2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

 

 

 

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