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6 L RF Rogers 3.38 ER 0.508 MM RF PCB For Microwave Sorbers , Imerssion Gold

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Shenzhen Xinchenger Electronic Co.,Ltd

6 L RF Rogers 3.38 ER 0.508 MM RF PCB For Microwave Sorbers , Imerssion Gold

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Product Details

6 L RF Rogers 3.38 ER 0.508 MM RF PCB For Microwave Sorbers , Imerssion Gold

 

Quick Detail :

Material Rogers 
TypePcb 
Layer6
Thinkness Board 0.508 mm 
Surface Finish Imerssion Gold 
Size 24*38cm 
ER 3.38

 

 

Features:

Microwave/RF PCB & High Frequency PCB uses materials of excellent dielectric property for its main body with other dielectric materials and metal substrates matched to complete corresponding multi-layer processing or thick-film processing and manufacture and to achieve the transmission functions of excellent high thermal conductivity, low dielectric constant, high frequency and high speed.

 

RF PCB are widely used in microwave transmission, Automobile telephone, wireless networks, wireless communications and satellite microwave communications, in particular the popularity of 3G networks exacerbate the market demand for the product on the RF PCB.

 

In order to meet increasing demands of Microwave & RF PCB for our customers all around the world, we have increased investment and intensity of research & development on Microwave high frequency PCB over the last few years. We're now experienced in professional production of various high-frequency circuit boards from quick turn prototypes to production run. For most of RF PCB materials (such as: Ceramic PCB, Teflon PCB, Rogers PCB, Taconic PCB, Arlon PCB), we have sufficient inventory to ensure fast delivery.

 

 

Description :

Low dielectric high-frequency multilayer rogers pcb ,improve the rogers 4003C pcb 's conductivity and the high quality make the customer save more costs .

High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.

 
High Frequency PCB Introuduction   
    
ModelParameterthickness(mm)Permittivity(ER)
F4BF4B0.382.2
 F4B0.552.23
 F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
 F4Bk0.8,1.52.65
 F4B0.83.5
 FE=F4BM12.2
RogersRO58800.254 0.508 0.7622.20 ± 0.02
 RO43500.254 0.508,0.8,1.5243.5
 RO40030.5083.38
TACONICTLF-350.83.5
 TLA-60.254,0.8,1,1.5,2.65
 TLX-80.254,0.8,1,1.62.55
 RF-60A0.646.15
 TLY-50.254,0.508,0.82.2
 TLC-320.8,1.5,33.2
 TLA-350.83.2
ARLONAD255C06099C1.52.55
 MCG0300CG0.83.7
 AD0300C0.83
 AD255C03099C0.82.55
 AD255C04099C12.55
 DLC22012.2

 

 

 

 

Production Description :

 

XCE PCB technical specifications
Annual stock MaterialRogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free
Layer No.1~16
Min board thickness

2 layer0.2mm

4 layer0.4mm

6 layer 0.6mm

8 layer 0.8mm

10 layer 1.0mm

Max panel size508*610mm
Board thickness toleranceT0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness>0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress28820Sec
Testing voltage50-300V
Min buried blind via0.2mm(8mil)
Outer copper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickless0.075mm-5mm
Taphole aperture0.2mm-0.6mm
Special technologyIndepedance,Blind buried via,thick gold,aluminum PCB
Surface finishHASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

 

 

Competitive Advantage:

1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .

 

 

What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

 

 

  

 

 

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