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High Frequency Multilayer pcb Fabrication Process With Rogers 3210 Substrate

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Shenzhen Xinchenger Electronic Co.,Ltd

High Frequency Multilayer pcb Fabrication Process With Rogers 3210 Substrate

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

 

High Frequency multilayer pcb fabrication process With Rogers 3210 Substrate

 
 
 
Detailed Product Description
Rogers 3210 High frequency Laminate in stock
Model:XCEHOrigin:Shenzhen
Size:8*9cmLayer2
Brand:XCEColor:Green
 

 

 

Specification

  • 2 layer
  • Green solder mask, 
  • Model:XCER
  • Copper THK: 1OZ
  • Location: Shenzhen

 

The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.

Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.

Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.

 

Rogers pcb material

 

PCB production capability
Files

Gerber, Protel, Powerpcb, Autocad, 

Orcad, Eagle,etc.

Material

FR-4, Hi-Tg FR-4, Lead free Materials 

(RoHS Compliant) , CEM-3, CEM-

1, 94V0,Aluminium, High frequency 

Material (Rogers, 

Teflon, Taconic)

Layer No.1 - 28 Layers
Board thickness0.0075"(0.2mm)-0.125"(3.2mm) 
Board Thickness Tolerance±10%
Copper thickness0.5OZ - 4OZ
Impedance Control±10%
Warpage0.075%-1.5%
Peelable0.012"(0.3mm)-0.02’(0.5mm)
Min Trace Width (a)0.005"(0.125mm)
Min Space Width (b)0.005"(0.125mm)
Min Annular Ring0.005"(0.125mm)
SMD Pitch (a)0.012"(0.3mm)

pcb with green solder mask 

and LF-FREE surface finishing BGA Pitch (b)

0.027"(0.675mm)
Regesiter torlerance0.05mm
Min Solder Mask Dam (a)0.005"(0.125mm)
Soldermask Clearance (b)0.005"(0.125mm)
Min SMT Pad spacing (c)0.004"(0.1mm)
Solder Mask Thickness0.0007"(0.018mm)
Hole size0.01"(0.25mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)±0.003"(±0.0762mm)
Aspect Ratio6:01
Hole Registration0.004"(0.1mm)
HASL2.5um
Lead free HASL2.5um
Immersion GoldNickel  3-7um  Au:1-3u''
OSP0.2-0.5um
Panel Outline Tol (+/-)±0.004''(±0.1mm)
Beveling30°45°
V-cut15° 30° 45° 60°
Surface finish

HAL, HASL Lead Free, Immersion 

gold, Gold plating, Gold finger,

 immersion silver, immersion Tin, 

OSP, Carbon ink,

Certificate ROHS  ISO9001:2008  TS16949  SGS  UL  CE
Special requirements

Buried and blind vias, Impedance 

control, via plug, BGA soldering 

and gold finger

 

Materials used for HF circuit boards

 

For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.

Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.

We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.

 

Which widely be used for :

Automotive Antennas / RFID

Back-up Aids
Collision Avoidance
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Power Amplifiers
High Reliability

Airborne Antenna Systems
Broadcast Satellites
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital

 

 

High frequency:

 

ModelParameterthickness(mm)Permittivity(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO58800.254    0.508  0.7622.20 ± 0.02
RO43500.254 0.508,0.8,1.5243.5
RO40030.5083.38
TACONICTLF-350.83.5
TLA-60.254,0.8,1,1.5,2.65
TLX-80.254,0.8,1,1.62.55
RF-60A0.646.15
TLY-50.254,0.508,0.82.2
TLC-320.8,1.5,33.2
TLA-350.83.2
ARLONAD255C06099C1.52.55
MCG0300CG0.83.7
AD0300C0.83
AD255C03099C0.82.55
AD255C04099C12.55
DLC22012.2
 

 

 

Advantage

 

1. PCB factory directly

2. PCB Have the comprehensive quality control system

3. PCB good price

4. PCB quick turn delivery time from 48hours

5. PCB certification(ISO/UL E354810/RoHS)

6. 12 years experience in exporting service

7. PCB is no MOQ/MOV.

8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting

 

One stop PCB assembly services Samples in 2-3 days | Bulk orders in 1 week | 2-year warranties Complete OEM assembly performed in-house Handle all customer's needs for PCB assembly,

component purchasing, and other product assemblies 
We quote for clients within 3 working days 

Testing: PCBA in-circuit testing, PCBA function testing, AOI, X-ray inspection Experience range:

industrial, automotive, computing and storage And consumer, instrumentation, medical, networking, peripherals, telecommunications

 

Our product range covers various fields, i.e. consumer electronics, telecommunications, industrial products, auto mobile assemblies, medical equipments etc.
  
Our main services include electronics and metal, casing manufacturing, such as PCB fabrication, component purchasing, PCB assembly, plastic injection molding, high volume metal stamping, die-casting and custom fabrication.
 

 

 

Some Typical Applications:
• Automotive radar applications
• Global positioning satellite
antennas
• Cellular telecommunications
systems - power amplifi ers and
antennas
• Patch antenna for wireless
communications
• Direct broadcast satellites
• Datalink on cable systems
• Remote meter readers

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