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High Frequency Rogers Pcb for Slim Sticker - type GSM / Cellular Quad Band Antenna

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Shenzhen Xinchenger Electronic Co.,Ltd

High Frequency Rogers Pcb for Slim Sticker - type GSM / Cellular Quad Band Antenna

Country/Region china
City & Province shenzhen guangdong
Categories Other Security & Protection Products
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Product Details

High Frequency Rogers Pcb Apply for Slim Sticker-type GSM/Cellular Quad-Band Antenna

 

 

 

 

Quick Detail
Item Discription
Material Rogers 
TypePcb 
Size10*4 cm
Permittivity 3
Surface FinishImmersion Gold 
Layer 4


 

 

Features:

     Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products . Immersion gold surface finish make the pcb 's conductive performance enhancements.Multilayer pcb design ,the precision of the pcb improves much more better . Low dielectric : 3 dielectric conductivity much more precision .

 

 

Description :

RO3003™ high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.

RO3003 excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant, which occurs near room temperature with PTFE glass materials. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GhZ.

 

 

Typical Applications:

  • Automotive radar
  • RF Couplers
  • Cost sensitive aerospace and defense applications
  • GPS Antennas
 

 

Production Description :

XCE PCB technical specifications
Annual stock MaterialRogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free
Layer No.1~16
Min board thickness

2 layer0.2mm

4 layer0.4mm

6 layer 0.6mm

8 layer 0.8mm

10 layer 1.0mm

Max panel size508*610mm
Board thickness toleranceT0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness>0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress28820Sec
Testing voltage50-300V
Min buried blind via0.2mm(8mil)
Outer copper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickless0.075mm-5mm
Taphole aperture0.2mm-0.6mm
Special technologyIndepedance,Blind buried via,thick gold,aluminum PCB
Surface finishHASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

 

 

Competitive Advantage:

1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .

 

 

What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

 

  

 

 

 

 

 

 

 

 

 

 

 

 

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