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High Frequency Multilayer Rigid PCB RT / Duroid 5880 Laminates 0.254 Stable Dielectric

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Shenzhen Xinchenger Electronic Co.,Ltd

High Frequency Multilayer Rigid PCB RT / Duroid 5880 Laminates 0.254 Stable Dielectric

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City & Province shenzhen guangdong
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Product Details

High Frequency Multilayer Rigid PCB RT / Duroid 5880 Laminates 0.254 Stable Dielectric

 

Quick Detail :
1. Type : Pcb
2. Material : Rogers
3. Layer : Multilayer
4. Products Size :11*9cm
5. Permittivity : 2.5
6. Surface finish : Immersion Gold 
 
Features:

 

RT/duroid® 5880 high frequency laminates are PTFE composites reinforced with glass microfibers.The randomly oriented microfibers result in exceptional dielectric constant uniformity.

The dielectric constant of these high frequency laminates is the lowest of all products, and low dielectric loss make them well suited for high frequency/ broad band applications where dispersion and losses need to be minimized. Because of its extremely low water absorption characteristics, RT/duroid 5880 laminates are ideal for applications in high moisture environments.

RT/duroid 5880 laminates are easily cut, sheared and machined to shape, and resistant to all solvents and reagents normally used in etching printed circuits or plating edges and holes. RT/duroid 5870 and 5880 laminates have the lowest electrical loss of any reinforced PTFE material, low moisture absorption, are isotropic, and have uniform electrical properties over frequency.

 

Parameter:

 

ModelParameterthickness(mm)Permittivity(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO58800.254 0.508 0.7622.20 ± 0.02
RO43500.254 0.508,0.8,1.5243.5
RO40030.5083.38
TACONICTLF-350.83.5
TLA-60.254,0.8,1,1.5,2.65
TLX-80.254,0.8,1,1.62.55
RF-60A0.646.15
TLY-50.254,0.508,0.82.2
TLC-320.8,1.5,33.2
TLA-350.83.2
ARLONAD255C06099C1.52.55
MCG0300CG0.83.7
AD0300C0.83
AD255C03099C0.82.55
AD255C04099C12.55
DLC22012.2

 

 
Description :

1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

4.RT/duroid high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.
 
Data : 

Layer1 to 28 layers
Material typeFR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness0.21mm to 7.0mm
Copper thickness0.5 OZ to 7.0 OZ
Copper thickness in hole>25.0 um (>1mil)

 

Size

Max. Board Size: 23 × 25 (580mm×900mm)
Min. Drilled Hole Size: 3mil (0.075mm)
Min. Line Width: 3mil (0.075mm)
Min. Line Spacing: 3mil (0.075mm)

 

Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

 

Tolerance

 

Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
CertificateUL, ISO 9001, ISO 14001
Special requirementsBuried and blind vias+controlled impedance +BGA
ProfilingPunching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

 

 

 

 

Benefits:

  • Low loss for excellent high frequency performance
  • Tight εr and thickness control
  • Excellent electrical and mechanical properties
  • Extremely low thermal coeffi cient of dielectric constant
  • In-plane expansion coeffi cient matched to copper
  • Low Z-axis expansion
  • Low outgassing; Ideal for space applications

 

 

 

Typical Applications:

  • commercial airline broadband antennas
  • microstrip and stripline circuits
  • millimeter wave applications
  • military radar systems
  • missile guidance systems
  • point-to-point digital radio antennas

Production Description :

ParameterValue
Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
Water absorption−0.125 in < 0.10%
Temperature index140 °C (284 °F)
Thermal conductivity, through-plane0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness110 M scale
Bond strength> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
Izod impact strength - LW> 54 J/m (10 ft·lb/in)
Izod impact strength - CW> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise> 415 MPa (60,200 psi)
Dielectric breakdown (A)> 50 kV
Dielectric breakdown (D48/50)> 50 kV
Dielectric strength20 MV/m
Relative permittivity (A)4.8
Relative permittivity (D24/23)4.8
Dissipation factor (A)0.017
Dissipation factor (D24/23)0.018
Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperatureCan vary, but is over 120 °C
Young's modulus - LW3.5×106 psi (24 GPa)
Young's modulus - CW3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis1.4×10−5 K−1
Coefficient of thermal expansion - y-axis1.2×10−5 K−1
Coefficient of thermal expansion - z-axis7.0×10−5 K−1
Poisson's ratio - LW0.136
Poisson's ratio - CW0.118
LW sound speed3602 m/s
SW sound speed3369 m/s

 
 
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
 
 
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
 
Detailed Images :
  
 
 
 
 
 
 

 

 


 
Payment Term :

 
 

 

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